ESQT-135-02-F-D-750

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Samtec Inc.

CONN SOCKET 70POS 0.079 GOLD PCB

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ESQT-135-02-F-D-750

Active

Samtec Inc.

CONN SOCKET 70POS 0.079 GOLD PCB

Deep-Dive with AI

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	ESQT-135-02-F-D-750

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	3 µin
Contact Finish Thickness - Mating	0.076 µm
Contact Length - Post	2.54 mm
Contact Length - Post	0.1 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Amps)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.75 in
Insulation Height	19.05 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	70
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Style	Board to Board, Cable
Termination	Solder

ESQT-135 Series

Part	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Color	Connector Type	Material Flammability Rating	Contact Finish - Mating	Pitch - Mating [x]	Pitch - Mating [x]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Type	Number of Rows	Style	Contact Finish - Post	Termination	Current Rating (Amps)	Insulation Material	Number of Positions	Contact Shape	Contact Material	Contact Length - Post	Contact Length - Post	Insulation Height [custom]	Insulation Height [custom]	Mounting Type	Fastening Type	Row Spacing - Mating	Row Spacing - Mating	Number of Positions Loaded	Insulation Height	Insulation Height	Contact Length - Post [x]	Contact Length - Post [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. ESQT-135-02-F-D-420	-55 °C	125 °C	Black	Elevated Socket	UL94 V-0	Gold	0.079 in	2 mm	3 µin	0.076 µm	Forked	2	Board to Board Cable	Tin	Solder	4.5 A	Liquid Crystal Polymer (LCP)	70	Square	Phosphor Bronze	0.43 in	10.92 mm	0.42 in	10.67 mm	Through Hole	Push-Pull	0.079 in	2 mm	All
Samtec Inc. ESQT-135-02-F-D-760	-55 °C	125 °C	Black	Elevated Socket	UL94 V-0	Gold	0.079 in	2 mm	3 µin	0.076 µm	Forked	2	Board to Board Cable	Tin	Solder	4.5 A	Liquid Crystal Polymer (LCP)	70	Square	Phosphor Bronze	0.09 "	2.29 mm			Through Hole	Push-Pull	0.079 in	2 mm	All	0.76 in	19.3 mm
Samtec Inc. ESQT-135-02-F-D-309	-55 °C	125 °C	Black	Elevated Socket	UL94 V-0	Gold	0.079 in	2 mm	3 µin	0.076 µm	Forked	2	Board to Board Cable	Tin	Solder	4.5 A	Liquid Crystal Polymer (LCP)	70	Square	Phosphor Bronze	0.541 in	13.74 mm			Through Hole	Push-Pull	0.079 in	2 mm	All	0.309 in	7.85 mm
Samtec Inc. ESQT-135-02-L-D-790	-55 °C	125 °C	Black	Elevated Socket	UL94 V-0	Gold	0.079 in	2 mm	10 çin	0.25 çm	Forked	2	Board to Board Cable	Tin	Solder	4.5 A	Liquid Crystal Polymer (LCP)	70	Square	Phosphor Bronze					Through Hole	Push-Pull	0.079 in	2 mm	All	0.79 in	20.07 mm	1.52 mm	0.06 in
Samtec Inc. ESQT-135-03-L-D-310	-55 °C	125 °C	Black	Elevated Socket	UL94 V-0	Gold	0.079 in	2 mm	10 çin	0.25 çm	Forked	2	Board to Board Cable	Tin	Solder	4.5 A	Liquid Crystal Polymer (LCP)	70	Square	Phosphor Bronze	0.148 in	3.76 mm			Through Hole	Push-Pull	0.079 in	2 mm	All	0.31 in	7.87 mm
Samtec Inc. ESQT-135-02-L-D-391	-55 °C	125 °C	Black	Elevated Socket	UL94 V-0	Gold	0.079 in	2 mm	10 çin	0.25 çm	Forked	2	Board to Board Cable	Tin	Solder	4.5 A	Liquid Crystal Polymer (LCP)	70	Square	Phosphor Bronze	0.459 in	11.66 mm			Through Hole	Push-Pull	0.079 in	2 mm	All	0.391 in	9.93 mm
Samtec Inc. ESQT-135-02-F-D-750	-55 °C	125 °C	Black	Elevated Socket	UL94 V-0	Gold	0.079 in	2 mm	3 µin	0.076 µm	Forked	2	Board to Board Cable	Tin	Solder	4.5 A	Liquid Crystal Polymer (LCP)	70	Square	Phosphor Bronze	0.1 in	2.54 mm			Through Hole	Push-Pull	0.079 in	2 mm	All	0.75 in	19.05 mm
Samtec Inc. ESQT-135-03-F-S-309	-55 °C	125 °C	Black	Elevated Socket	UL94 V-0	Gold	0.079 in	2 mm	3 µin	0.076 µm	Forked	1	Board to Board Cable	Tin	Solder	4.5 A	Liquid Crystal Polymer (LCP)	35	Square	Phosphor Bronze					Through Hole	Push-Pull			All	0.309 in	7.85 mm	3.78 mm	0.149 in
Samtec Inc. ESQT-135-02-G-Q-368	-55 °C	125 °C	Black	Elevated Socket	UL94 V-0	Gold	0.079 in	2 mm	20 µin	0.51 µm	Forked		Board to Board Cable	Gold	Solder	4.5 A	Liquid Crystal Polymer (LCP)	140	Square	Phosphor Bronze					Through Hole	Push-Pull	0.079 in	2 mm	All	0.368 in	9.35 mm	12.24 mm	0.482 in	3 µin	0.076 µm
Samtec Inc. ESQT-135-02-F-6-670	-55 °C	125 °C	Black	Elevated Socket	UL94 V-0	Gold	0.079 in	2 mm	3 µin	0.076 µm	Forked	6	Board to Board Cable	Tin	Solder	4.5 A	Liquid Crystal Polymer (LCP)	210	Square	Phosphor Bronze	0.18 in	4.57 mm			Through Hole	Push-Pull	0.079 in	2 mm	All	0.67 "	17.02 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	8	$ 16.14

Description

General part information

ESQT-135 Series

70 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

Technical documentation and resources

No documents available