Specification	HLE-102-02-SM-DV-BE-LC

Connector Type	Bottom Entry, Receptacle
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 µin
Contact Material	Beryllium Copper
Contact Shape	Square
Contact Type	Female Socket
Current Rating (Per Contact)	4.1 A
Fastening Type	Push-Pull
Features	Board Lock
Insulation Color	Black
Insulation Height	0.144 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Surface Mount
Number of Positions	4
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Style	Board
Termination	Solder
Voltage Rating	400 V

HLE-102 Series

Part	Insulation Color	Operating Temperature (Max)	Operating Temperature (Min)	Number of Positions Loaded	Termination	Style	Fastening Type	Current Rating (Per Contact)	Mounting Type	Connector Type	Contact Finish Thickness - Mating	Voltage Rating	Row Spacing - Mating	Number of Rows	Contact Type	Pitch - Mating	Insulation Height	Number of Positions	Contact Finish - Post	Contact Finish - Mating	Contact Shape	Insulation Material	Contact Material	Contact Length - Post	Features	Contact Finish Thickness - Post
Samtec Inc. HLE-150-02-F-DV	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Receptacle	3 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. HLE-150-02-F-DV-TE	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Through Hole	Receptacle	3 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.138 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	0.12 in
Samtec Inc. HLE-150-02-S-DV	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Receptacle	30 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. HLE-150-02-L-DV-TE	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Through Hole	Receptacle	10 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.138 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	0.12 in
Samtec Inc. HLE-150-02-S-DV-A-K	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Receptacle	30 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper		Board Guide Pick and Place
Samtec Inc. HLE-150-02-G-DV-A	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Receptacle	20 Ąin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Gold	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper		Board Guide	3 µin
Samtec Inc. HLE-150-02-G-DV-BE	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Bottom Entry Receptacle	20 Ąin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Gold	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper			3 µin
Samtec Inc. HLE-150-02-S-DV-A-P	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Surface Mount	Receptacle	30 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.144 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper		Board Guide Pick and Place
Samtec Inc. HLE-150-02-L-DV-PE	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Through Hole	Pass Through Receptacle	10 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.138 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	0.09 in
Samtec Inc. HLE-150-02-S-DV-PE	Black	125 °C	-55 °C	All	Solder	Board	Push-Pull	4.1 A	Through Hole	Pass Through Receptacle	30 µin	400 V	0.1 in	2	Female Socket	0.1 in	0.138 in	100	Tin	Gold	Square	Liquid Crystal Polymer (LCP)	Beryllium Copper	0.09 in

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