DSPIC33FJ09GS302-I/MM
ActiveMicrochip Technology
HIGH-SPEED PWM, ADC AND COMPARATORS
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DSPIC33FJ09GS302-I/MM
ActiveMicrochip Technology
HIGH-SPEED PWM, ADC AND COMPARATORS
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | DSPIC33FJ09GS302-I/MM | dsPIC33FJ09GS302 Series |
|---|---|---|
| - | - | |
| Connectivity | LINbus, I2C, IrDA, SPI, UART/USART | LINbus, I2C, IrDA, SPI, UART/USART |
| Core Processor | dsPIC | dsPIC |
| Core Size | 16-Bit | 16-Bit |
| Data Converters | A/D 8x10b, D/A 2x10b | A/D 8x10b, D/A 2x10b |
| Grade | - | Automotive |
| Mounting Type | Surface Mount | Through Hole, Surface Mount |
| Number of I/O | 21 I/O | 21 I/O |
| Operating Temperature [Max] | 85 °C | 85 - 125 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Oscillator Type | Internal | Internal |
| Package / Case | 28-VQFN Exposed Pad | 28-DIP, 28-SSOP, 28-VQFN Exposed Pad, 28-UQFN Exposed Pad, 28-SOIC |
| Package / Case | - | 0.3 in |
| Package / Case | - | 7.62 mm |
| Package / Case | - | 0.209 in |
| Package / Case | - | 5.3 mm |
| Package / Case | - | 0.295 in |
| Package / Case | - | 7.5 mm |
| Program Memory Size | 9 KB | 9 KB |
| Program Memory Type | FLASH | FLASH |
| Qualification | - | AEC-Q100 |
| RAM Size | 1 K | 1 K |
| Speed | 40 MIPs | 40 MIPs |
| Supplier Device Package | 28-QFN-S (6x6) | 28-SPDIP, 28-SSOP, 28-QFN-S (6x6), 28-UQFN (6x6), 28-SOIC |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 244 | $ 3.49 | |
| Microchip Direct | TUBE | 1 | $ 4.22 | |
| 25 | $ 3.86 | |||
| 100 | $ 3.49 | |||
| 1000 | $ 3.21 | |||
| 5000 | $ 3.06 | |||
dsPIC33FJ09GS302 Series
High-Speed PWM, ADC and Comparators
| Part | Oscillator Type | Core Processor | Speed | Program Memory Type | RAM Size | Number of I/O | Supplier Device Package | Core Size | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case | Package / Case | Package / Case | Program Memory Size | Connectivity | Data Converters | Package / Case [custom] | Package / Case [custom] | Grade | Qualification | Package / Case [x] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology DSPIC33FJ09GS302-I/SP | Internal | dsPIC | 40 MIPs | FLASH | 1 K | 21 I/O | 28-SPDIP | 16-Bit | Through Hole | 85 °C | -40 °C | 0.3 in | 28-DIP | 7.62 mm | 9 KB | I2C, IrDA, LINbus, SPI, UART/USART | A/D 8x10b, D/A 2x10b | ||||||
Microchip Technology DSPIC33FJ09GS302-I/SS | Internal | dsPIC | 40 MIPs | FLASH | 1 K | 21 I/O | 28-SSOP | 16-Bit | Surface Mount | 85 °C | -40 °C | 28-SSOP | 9 KB | I2C, IrDA, LINbus, SPI, UART/USART | A/D 8x10b, D/A 2x10b | 0.209 in | 5.3 mm | ||||||
Microchip Technology DSPIC33FJ09GS302-I/MM | Internal | dsPIC | 40 MIPs | FLASH | 1 K | 21 I/O | 28-QFN-S (6x6) | 16-Bit | Surface Mount | 85 °C | -40 °C | 28-VQFN Exposed Pad | 9 KB | I2C, IrDA, LINbus, SPI, UART/USART | A/D 8x10b, D/A 2x10b | ||||||||
Microchip Technology DSPIC33FJ09GS302-I/SP | |||||||||||||||||||||||
Microchip Technology DSPIC33FJ09GS302-I/SO | |||||||||||||||||||||||
Microchip Technology DSPIC33FJ09GS302-E/MX | Internal | dsPIC | 40 MIPs | FLASH | 1 K | 21 I/O | 28-UQFN (6x6) | 16-Bit | Surface Mount | 125 °C | -40 °C | 28-UQFN Exposed Pad | 9 KB | I2C, IrDA, LINbus, SPI, UART/USART | A/D 8x10b, D/A 2x10b | Automotive | AEC-Q100 | ||||||
Microchip Technology DSPIC33FJ09GS302-I/SS | |||||||||||||||||||||||
Microchip Technology DSPIC33FJ09GS302-I/SO | |||||||||||||||||||||||
Microchip Technology DSPIC33FJ09GS302-E/SO | Internal | dsPIC | 40 MIPs | FLASH | 1 K | 21 I/O | 28-SOIC | 16-Bit | Surface Mount | 125 °C | -40 °C | 28-SOIC | 9 KB | I2C, IrDA, LINbus, SPI, UART/USART | A/D 8x10b, D/A 2x10b | Automotive | AEC-Q100 | 0.295 in | 7.5 mm | ||||
Microchip Technology DSPIC33FJ09GS302-E/MX | |||||||||||||||||||||||
Microchip Technology DSPIC33FJ09GS302-E/MM | Internal | dsPIC | 40 MIPs | FLASH | 1 K | 21 I/O | 28-QFN-S (6x6) | 16-Bit | Surface Mount | 125 °C | -40 °C | 28-VQFN Exposed Pad | 9 KB | I2C, IrDA, LINbus, SPI, UART/USART | A/D 8x10b, D/A 2x10b | Automotive | AEC-Q100 | ||||||
Microchip Technology DSPIC33FJ09GS302-E/SO | |||||||||||||||||||||||
Microchip Technology DSPIC33FJ09GS302-I/SO | Internal | dsPIC | 40 MIPs | FLASH | 1 K | 21 I/O | 28-SOIC | 16-Bit | Surface Mount | 85 °C | -40 °C | 28-SOIC | 9 KB | I2C, IrDA, LINbus, SPI, UART/USART | A/D 8x10b, D/A 2x10b | 0.295 in | 7.5 mm |
Description
General part information
dsPIC33FJ09GS302 Series
These devices offer features supporting common, multi-loop digital switch-mode power supplies (SMPS) and other digital power-conversion applications such as: AC to DC Converters, DC to DC Converters, Power Factor Correction (PFC), Uninterruptible power supply (UPS), Inverters, Embedded Power-Supply Controllers, Circuit Breakers, Arc Fault Detection, Digital Lighting
Documents
Technical documentation and resources