110-83-952-41-001101

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Preci-Dip

CONN IC DIP SOCKET 52POS GOLD

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110-83-952-41-001101

Active

Preci-Dip

CONN IC DIP SOCKET 52POS GOLD

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	350	$ 3.76

Description

General part information

110-83 Series

52 (2 x 26) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	110-83-952-41-001101	110-83 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	29.5 Áin	29.5 Áin
Contact Finish Thickness - Mating	0.75 Ám	0.75 Ám
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame	Open Frame, No Center Bar
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Surface Mount
Number of Positions or Pins (Grid)	-	2 - 64
Number of Positions or Pins (Grid)	-	2 x 5, 2 x 16
Number of Positions or Pins (Grid)	-	10
Number of Positions or Pins (Grid)	-	3 - 20
Number of Positions or Pins (Grid)	-	2
Number of Positions or Pins (Grid)	-	32
Number of Positions or Pins (Grid)	-	6
Number of Positions or Pins (Grid)	-	4
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3 - 3.18 mm
Termination Post Length	0.125 in	0.118 - 0.125 in
Type	22.86 mm	5.08 - 22.86 mm
Type	DIP	DIP
Type	0.9 in	0.2 - 0.9 "

110-83 Series

CONN IC DIP SOCKET 16POS GOLD

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Part	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Type	Type	Type	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Contact Material - Mating	Pitch - Post	Pitch - Post	Mounting Type	Contact Material - Post [custom]	Material Flammability Rating	Contact Resistance	Features	Housing Material	Contact Finish - Post	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 110-83-316-01-931101	8, 16	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin
Preci-Dip 110-83-324-41-105161	24	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.118 in	3 mm
Preci-Dip 110-83-328-41-105161	28	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.118 in	3 mm
Preci-Dip 110-83-310-41-001101		Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.125 in	3.18 mm	2 x 5	10
Preci-Dip 110-83-210-41-005101		Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.2 in	5.08 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin			2 x 5	10
Preci-Dip 110-83-320-41-001151	20	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	UL94 V-0	10 mOhm	No Center Bar, Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.125 in	3.18 mm
Preci-Dip 110-83-640-41-005101	40	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.6 in	15.24 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin					20	2
Preci-Dip 110-83-314-41-105191	14	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.118 in	3 mm
Preci-Dip 110-83-324-41-105101	24	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.118 in	3 mm
Preci-Dip 110-83-210-41-105101		Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.2 in	5.08 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.118 in	3 mm	2 x 5	10