EMIF06-HSD04F3
ActiveEMI FILTER 15-PIN FLIPCHIP SOLDER SMD T/R
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EMIF06-HSD04F3
ActiveEMI FILTER 15-PIN FLIPCHIP SOLDER SMD T/R
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Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | EMIF06-HSD04F3 | EMIF06 Series |
|---|---|---|
| - | - | |
| Applications | Data Lines for Mobile Devices | Data Lines for Mobile Devices, General Purpose |
| Attenuation Value | - | -40 - -34 dB |
| Center / Cutoff Frequency | - | 550 MHz |
| Current | - | 10 mA |
| ESD Protection | True | True |
| Filter Order | 2nd | 2nd |
| Height [z] | 0.022 in | 0.022 - 0.217 in |
| Height [z] | 0.55 mm | 0.55 - 5.5 mm |
| Mounting Type | Surface Mount | Surface Mount, Wettable Flank |
| Number of Channels [custom] | 6 | 6 |
| Operating Temperature [Max] | 85 °C | 85 - 150 °C |
| Operating Temperature [Min] | -40 °C | -55 - -30 °C |
| Package / Case | 15-UFBGA, FCBGA | 15-UFBGA, FCBGA, 16-WFBGA, 12-WFDFN Exposed Pad, 15-WFBGA, 12-UFDFN Exposed Pad |
| Resistance - Channel (Ohms) | 1 Ohms | 1 - 100 Ohms |
| Size / Dimension | - | 1.29 - 1.54 mm |
| Size / Dimension | - | 1.54 mm |
| Size / Dimension [x] | 0.064 in | 0.061 - 0.118 in |
| Size / Dimension [x] | 1.62 mm | 0.061 - 3 mm |
| Size / Dimension [y] | 1.62 mm | 0.061 - 1.92 mm |
| Size / Dimension [y] | 0.064 in | 0.051 - 0.076 in |
| Technology | RC (Pi) | RC (Pi), RC |
| Type | Low Pass | Low Pass |
| Values | 4.5 pF, 1 Ohm | 1 - 100 pF |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 5000 | $ 0.19 | |
EMIF06 Series
EMI FILTER 15-PIN FLIPCHIP SOLDER SMD T/R
| Part | ESD Protection | Resistance - Channel (Ohms) | Type | Mounting Type | Filter Order | Values | Applications | Technology | Number of Channels [custom] | Package / Case | Size / Dimension [y] | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [x] | Height [z] | Height [z] | Operating Temperature [Max] | Operating Temperature [Min] | Size / Dimension [y] | Size / Dimension [x] | Center / Cutoff Frequency | Attenuation Value | Current |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics EMIF06-HSD04F3 | 1 Ohms | Low Pass | Surface Mount | 2nd | 1 Ohm, 4.5 pF | Data Lines for Mobile Devices | RC (Pi) | 6 | 15-UFBGA, FCBGA | 1.62 mm | 0.064 in | 0.064 in | 1.62 mm | 0.022 in | 0.55 mm | 85 °C | -40 °C | ||||||
STMicroelectronics EMIF06-MSD04F3 | 40 Ohms | Low Pass | Surface Mount | 2nd | 7.5 pF, 40 Ohms | Data Lines for Mobile Devices | RC (Pi) | 6 | 16-WFBGA, FCBGA | 0.061 " | 0.061 " | 0.026 in | 0.65 mm | 85 °C | -40 °C | 1.54 mm | 1.54 mm | 550 MHz | |||||
STMicroelectronics EMIF06-MSD04F3 | |||||||||||||||||||||||
STMicroelectronics EMIF06-MSD04F3 | |||||||||||||||||||||||
STMicroelectronics EMIF06-USD04F3 | |||||||||||||||||||||||
STMicroelectronics EMIF06-USD14F3 | 40 Ohms | Low Pass | Surface Mount | 2nd | 7.5 pF, 40 Ohms | Data Lines for Mobile Devices | RC (Pi) | 6 | 15-UFBGA, FCBGA | 0.061 " | 0.061 " | 0.217 " | 5.5 mm | 85 °C | -30 ░C | 1.54 mm | 1.54 mm | ||||||
STMicroelectronics EMIF06-1005MX12Y | 100 Ohms | Low Pass | Surface Mount, Wettable Flank | 2nd | 45 pF, 100 Ohms | Data Lines for Mobile Devices | RC (Pi) | 6 | 12-WFDFN Exposed Pad | 1.35 mm | 0.053 in | 0.118 in | 3 mm | 0.032 in | 0.8 mm | 150 °C | -55 °C | -34 dB | |||||
STMicroelectronics EMIF06-1005M12 | |||||||||||||||||||||||
STMicroelectronics EMIF06-1005M12 | |||||||||||||||||||||||
STMicroelectronics EMIF06-10006F2 | 100 Ohms | Low Pass | Surface Mount | 2nd | 60 pF, 100 Ohms | Data Lines for Mobile Devices | RC (Pi) | 6 | 15-WFBGA, FCBGA | 0.051 " | 0.115 in | 2.92 mm | 0.028 in | 0.7 mm | 85 °C | -40 °C | 1.29 mm | 10 mA |
Description
General part information
EMIF06 Series
The EMIF06-HSD04F3 chip is a highly integrated device designed to protect the application against ESD event during the insertion of the micro-SD card.The EMIF06-HSD04F3 must be placed close to the micro-SD card connector for efficient ESD protection.TM: IPAD is a trademark of STMicroelectronicsVery low line capacitance to compensate long PCB tracks (4.5 pF typ.)208 MHz clock frequency compliant with SD3.0 UHS-1 SDR 104 standardHigh ESD robustness: up to ±12 kV contactLead-free package in 400 µm pitchPackage thickness: 500 µm typ.Very low PCB space consumptionHigh reliability offer by the monolithic integrationComplies with the following standards:IEC 61000-4-2 level 4±15 kV (air discharge)±8 kV (contact discharge)
Documents
Technical documentation and resources
No documents available