7131-108-18

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Aries Electronics

SOCKET ADAPT HB2E RELAY TO 8DIP

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Aries Electronics

SOCKET ADAPT HB2E RELAY TO 8DIP

Technical Specifications

Parameters and characteristics for this part

Specification	7131-108-18

Board Material	FR4 Epoxy Glass
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	HB2E Relay
Convert To (Adapter End)	0.3 in
Convert To (Adapter End)	DIP
Convert To (Adapter End)	7.62 mm
Mounting Type	Through Hole
Number of Pins	8
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in

SOCKET ADAPT HB2E RELAY TO 8DIP

Part	Number of Pins	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Termination Post Length	Termination Post Length	Board Material	Convert From (Adapter End)	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Contact Finish - Post	Contact Material - Post [custom]
Aries Electronics 7131-108-18	8	0.3 in	DIP	7.62 mm	3.18 mm	0.125 in	FR4 Epoxy Glass	HB2E Relay	Through Hole	200 µin	5.08 µm	Solder	Tin-Lead	Brass

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

IC Socket Adapter HB2E Relay To DIP, 0.3" (7.62mm) Row Spacing Through Hole

Technical documentation and resources