IRFU2405PBF

Obsolete

Infineon Technologies

IR MOSFET™ N-CHANNEL ; IPAK TO-251 PACKAGE; 16 MOHM;

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DocumentsIR Part Numbering System Datasheet

IRFU2405PBF

Obsolete

Infineon Technologies

IR MOSFET™ N-CHANNEL ; IPAK TO-251 PACKAGE; 16 MOHM;

Deep-Dive with AI

DocumentsIR Part Numbering System Datasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	IRFU2405PBF

Current - Continuous Drain (Id) @ 25°C	56 A
Drain to Source Voltage (Vdss)	55 V
Drive Voltage (Max Rds On, Min Rds On)	10 V
FET Type	N-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]	110 nC
Input Capacitance (Ciss) (Max) @ Vds	2430 pF
Mounting Type	Through Hole
Operating Temperature [Max]	175 ░C
Operating Temperature [Min]	-55 °C
Package / Case	IPAK, TO-251-3 Short Leads, TO-251AA
Power Dissipation (Max) [Max]	110 W
Rds On (Max) @ Id, Vgs	16 mOhm
Supplier Device Package	IPAK (TO-251AA)
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id	4 V

IRFU2405 Series

Part	Vgs (Max)	Package / Case	Current - Continuous Drain (Id) @ 25°C	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Vgs(th) (Max) @ Id	Input Capacitance (Ciss) (Max) @ Vds	Gate Charge (Qg) (Max) @ Vgs [Max]	Supplier Device Package	FET Type	Drain to Source Voltage (Vdss)	Technology	Rds On (Max) @ Id, Vgs	Power Dissipation (Max) [Max]	Drive Voltage (Max Rds On, Min Rds On)
Infineon Technologies IRFU2405PBF	20 V	IPAK TO-251-3 Short Leads TO-251AA	56 A	Through Hole	-55 °C	175 ░C	4 V	2430 pF	110 nC	IPAK (TO-251AA)	N-Channel	55 V	MOSFET (Metal Oxide)	16 mOhm	110 W	10 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

IRFU2405 Series

The IR MOSFET family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS, lighting, load switches as well as battery powered applications.The devices are available in a variety of surface mount and through-hole packages with industry standard footprints for ease of design.

Documents

Technical documentation and resources