Specification	ESS-120-T-23

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Length - Post	0.123 in
Contact Material	Beryllium Copper
Contact Shape	Circular
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.3 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	20
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Style	Board
Termination	Solder

ESS-120 Series

Part	Number of Positions	Style	Fastening Type	Insulation Color	Contact Finish - Mating	Contact Length - Post	Contact Finish - Post	Mounting Type	Contact Type	Number of Rows	Contact Finish Thickness - Mating	Insulation Height	Number of Positions Loaded	Pitch - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Termination	Connector Type	Material Flammability Rating	Contact Material	Contact Shape	Insulation Material	Contact Finish Thickness - Post
Samtec Inc. ESS-132-T-04	32	Board	Push-Pull	Black	Gold	0.123 in	Tin	Through Hole	Female Socket	1	10 µin	0.4 in	All	0.1 in	125 °C	-55 °C	Solder	Elevated Socket	UL94 V-0	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESS-132-TT-07	32	Board	Push-Pull	Black	Tin	0.265 in	Tin	Through Hole	Female Socket	1		0.4 in	All	0.1 in	125 °C	-55 °C	Solder	Elevated Socket	UL94 V-0	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESS-132-G-23	32	Board	Push-Pull	Black	Gold	0.123 in	Gold	Through Hole	Female Socket	1	10 µin	0.3 in	All	0.1 in	125 °C	-55 °C	Solder	Elevated Socket	UL94 V-0	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	10 µin
Samtec Inc. ESS-132-T-03	32	Board	Push-Pull	Black	Gold	0.123 in	Tin	Through Hole	Female Socket	1	10 µin	0.3 in	All	0.1 in	125 °C	-55 °C	Solder	Elevated Socket	UL94 V-0	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESS-132-G-28	32	Board	Push-Pull	Black	Gold	0.373 in	Gold	Through Hole	Female Socket	1	10 µin	0.3 in	All	0.1 in	125 °C	-55 °C	Solder	Elevated Socket	UL94 V-0	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	10 µin
Samtec Inc. ESS-132-G-07	32	Board	Push-Pull	Black	Gold	0.265 in	Gold	Through Hole	Female Socket	1	10 µin	0.4 in	All	0.1 in	125 °C	-55 °C	Solder	Elevated Socket	UL94 V-0	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	10 µin
Samtec Inc. ESS-132-T-24	32	Board	Push-Pull	Black	Gold	0.123 in	Tin	Through Hole	Female Socket	1	10 µin	0.4 in	All	0.1 in	125 °C	-55 °C	Solder	Elevated Socket	UL94 V-0	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESS-132-T-28	32	Board	Push-Pull	Black	Gold	0.373 in	Tin	Through Hole	Female Socket	1	10 µin	0.3 in	All	0.1 in	125 °C	-55 °C	Solder	Elevated Socket	UL94 V-0	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESS-132-G-08	32	Board	Push-Pull	Black	Gold	0.365 in	Gold	Through Hole	Female Socket	1	10 µin	0.3 in	All	0.1 in	125 °C	-55 °C	Solder	Elevated Socket	UL94 V-0	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	10 µin
Samtec Inc. ESS-132-G-05	32	Board	Push-Pull	Black	Gold	0.173 in	Gold	Through Hole	Female Socket	1	10 µin	0.5 in	All	0.1 in	125 °C	-55 °C	Solder	Elevated Socket	UL94 V-0	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	10 µin

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ESS-120-T-23 | Datasheet