R5F5671CDGFP#30

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Renesas Electronics Corporation

32-BIT MICROCONTROLLERS FOR FAST REAL-TIME CONTROL AND CONTACTLESS HMI

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R5F5671CDGFP#30

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Renesas Electronics Corporation

32-BIT MICROCONTROLLERS FOR FAST REAL-TIME CONTROL AND CONTACTLESS HMI

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Description Specifications Series Pricing CAD Documents

Description

General part information

RX600 Series

The RX671 group microcontrollers deliver superior real-time performance with the RXv3 core running at 120MHz. The HMI functions enable contactless operation by proximity switches and voice recognition, making it possible to realize hygienic HMI suitable for the new normal. A wide variety of packages, including the 4.5mm x 4.5mm 64-pin TFBGA, is all equipped with 2MB flash memory and 384KB SRAM to meet a wide range of needs with a single chip.

Technical Specifications

Parameters and characteristics for this part

Specification	R5F5671CDGFP#30

A/D Channels	16 count
A/D Resolution (bits)	12 bit
Connectivity	SPI, CANbus, I2C, USB, SCI, LINbus, QSPI
Core Configuration	Single-Core
Core Processor	RXv3
Core Size (Bit Width)	32 Bit
EEPROM Size (Depth)	8 K
EEPROM Size (Width)	8 bit
Mounting Type	Surface Mount
Number of I/O	80
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package / Case	100-LQFP
Package Length	14 mm
Package Name	100-LFQFP
Package Width	14 mm
Peripherals	DMA, PWM, LVD, Capacitive Touch, POR, WDT
Program Memory Depth	1.5 M
Program Memory Size	1.5 MB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	384 K
RAM Size Width	8 bit
Speed	120 MHz
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	2.7 V

RX600 Series

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Part	Connectivity	Program Memory Type	Speed	Core Processor	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	EEPROM Size (Width)	EEPROM Size (Depth)	Operating Temperature (Max)	Operating Temperature (Min)	Number of I/O	Core Size (Bit Width)	Mounting Type	RAM Size Width	RAM Size Depth	Peripherals	Oscillator Type	A/D Resolution (bits)	A/D Channels	Program Memory Size	Program Memory Width	Program Memory Depth	Package / Case	Package Width	Package Name	Package Length	Core Configuration
Renesas Electronics Corporation R5F56719HDFM#10	I2C LINbus QSPI SCI SPI USB	FLASH	120 MHz	RXv3	3.6 V	2.7 V	8 bit	8 K	85 °C	-40 °C	44	32 Bit	Surface Mount	8 bit	384 K	Capacitive Touch DMA LVD POR PWM WDT	Internal	12 bit	10 count	1 MB	8 bit	1 M	64-LQFP	10 mm	64-LFQFP	10 mm	Single-Core
Renesas Electronics Corporation R5F56719HDFP#10	CANbus I2C LINbus QSPI SCI SPI USB	FLASH	120 MHz	RXv3	3.6 V	2.7 V	8 bit	8 K	85 °C	-40 °C	80	32 Bit	Surface Mount	8 bit	384 K	Capacitive Touch DMA LVD POR PWM WDT	Internal	12 bit	16 count	1 MB	8 bit	1 M	100-LQFP	14 mm	100-LFQFP	14 mm	Single-Core
Renesas Electronics Corporation R5F56719HDFB#10	CANbus I2C LINbus QSPI SCI SPI USB	FLASH	120 MHz	RXv3	3.6 V	2.7 V	8 bit	8 K	85 °C	-40 °C	113	32 Bit	Surface Mount	8 bit	384 K	Capacitive Touch DMA LVD POR PWM WDT	Internal	12 bit	20 count	1 MB	8 bit	1 M	144-LQFP	20 mm	144-LFQFP	20 mm	Single-Core
Renesas Electronics Corporation R5F56719HGFB#10	CANbus I2C LINbus QSPI SCI SPI USB	FLASH	120 MHz	RXv3	3.6 V	2.7 V	8 bit	8 K	105 °C	-40 °C	113	32 Bit	Surface Mount	8 bit	384 K	Capacitive Touch DMA LVD POR PWM WDT	Internal	12 bit	20 count	1 MB	8 bit	1 M	144-LQFP	20 mm	144-LFQFP	20 mm	Single-Core
Renesas Electronics Corporation R5F56719DGFP#10	CANbus I2C LINbus QSPI SCI SPI USB	FLASH	120 MHz	RXv3	3.6 V	2.7 V	8 bit	8 K	105 °C	-40 °C	80	32 Bit	Surface Mount	8 bit	384 K	Capacitive Touch DMA LVD POR PWM WDT	Internal	12 bit	16 count	1 MB	8 bit	1 M	100-LQFP	14 mm	100-LFQFP	14 mm	Single-Core

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

R5F5671CDGFP#30 | Datasheet

Datasheet