ESQT-136-02-G-D-368

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Samtec Inc.

CONN SOCKET 72POS 0.079 GOLD PCB

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ESQT-136-02-G-D-368

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Samtec Inc.

CONN SOCKET 72POS 0.079 GOLD PCB

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	ESQT-136-02-G-D-368

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.51 µm
Contact Finish Thickness - Mating	20 µin
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Post [x]	0.482 in
Contact Length - Post [x]	12.24 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Amps)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	9.35 mm
Insulation Height	0.368 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	72
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Style	Board to Board, Cable
Termination	Solder

ESQT-136 Series

Part	Contact Shape	Contact Length - Post	Contact Length - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material	Contact Finish - Mating	Insulation Height	Insulation Height	Pitch - Mating [x]	Pitch - Mating [x]	Material Flammability Rating	Mounting Type	Row Spacing - Mating	Row Spacing - Mating	Contact Type	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Connector Type	Style	Termination	Contact Finish - Post	Insulation Color	Number of Rows	Fastening Type	Insulation Material	Number of Positions Loaded	Number of Positions	Contact Length - Post [x]	Contact Length - Post [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post
Samtec Inc. ESQT-136-02-F-D-309	Square	0.541 in	13.74 mm	3 µin	0.076 µm	Phosphor Bronze	Gold	0.309 in	7.85 mm	0.079 in	2 mm	UL94 V-0	Through Hole	0.079 in	2 mm	Forked	4.5 A	-55 °C	125 °C	Elevated Socket	Board to Board Cable	Solder	Tin	Black	2	Push-Pull	Liquid Crystal Polymer (LCP)	All	72
Samtec Inc. ESQT-136-02-F-5-750	Square	0.1 in	2.54 mm	3 µin	0.076 µm	Phosphor Bronze	Gold	0.75 in	19.05 mm	0.079 in	2 mm	UL94 V-0	Through Hole	0.079 in	2 mm	Forked	4.5 A	-55 °C	125 °C	Elevated Socket	Board to Board Cable	Solder	Tin	Black	5	Push-Pull	Liquid Crystal Polymer (LCP)	All	180
Samtec Inc. ESQT-136-02-F-Q-710	Square			3 µin	0.076 µm	Phosphor Bronze	Gold	0.71 "	18.03 mm	0.079 in	2 mm	UL94 V-0	Through Hole	0.079 in	2 mm	Forked	4.5 A	-55 °C	125 °C	Elevated Socket	Board to Board Cable	Solder	Tin	Black		Push-Pull	Liquid Crystal Polymer (LCP)	All	144	3.56 mm	0.14 in
Samtec Inc. ESQT-136-02-G-Q-370	Square		0.48 in	20 µin	0.51 µm	Phosphor Bronze	Gold	0.37 in	9.4 mm	0.079 in	2 mm	UL94 V-0	Through Hole	0.079 in	2 mm	Forked	4.5 A	-55 °C	125 °C	Elevated Socket	Board to Board Cable	Solder	Gold	Black		Push-Pull	Liquid Crystal Polymer (LCP)	All	144			3 µin	0.076 µm	12.19 mm
Samtec Inc. ESQT-136-03-G-Q-370	Square			20 µin	0.51 µm	Phosphor Bronze	Gold	0.37 in	9.4 mm	0.079 in	2 mm	UL94 V-0	Through Hole	0.079 in	2 mm	Forked	4.5 A	-55 °C	125 °C	Elevated Socket	Board to Board Cable	Solder	Gold	Black		Push-Pull	Liquid Crystal Polymer (LCP)	All	144	2.23 mm	0.088 in	3 µin	0.076 µm
Samtec Inc. ESQT-136-03-G-D-375	Square	0.083 in	2.11 mm	20 µin	0.51 µm	Phosphor Bronze	Gold	0.375 in	9.53 mm	0.079 in	2 mm	UL94 V-0	Through Hole	0.079 in	2 mm	Forked	4.5 A	-55 °C	125 °C	Elevated Socket	Board to Board Cable	Solder	Gold	Black	2	Push-Pull	Liquid Crystal Polymer (LCP)	All	72			3 µin	0.076 µm
Samtec Inc. ESQT-136-03-G-Q-368	Square	0.09 "	2.29 mm	20 µin	0.51 µm	Phosphor Bronze	Gold	0.368 in	9.35 mm	0.079 in	2 mm	UL94 V-0	Through Hole	0.079 in	2 mm	Forked	4.5 A	-55 °C	125 °C	Elevated Socket	Board to Board Cable	Solder	Gold	Black		Push-Pull	Liquid Crystal Polymer (LCP)	All	144			3 µin	0.076 µm
Samtec Inc. ESQT-136-02-G-Q-750	Square	0.1 in	2.54 mm	20 µin	0.51 µm	Phosphor Bronze	Gold	0.75 in	19.05 mm	0.079 in	2 mm	UL94 V-0	Through Hole	0.079 in	2 mm	Forked	4.5 A	-55 °C	125 °C	Elevated Socket	Board to Board Cable	Solder	Gold	Black		Push-Pull	Liquid Crystal Polymer (LCP)	All	144			3 µin	0.076 µm
Samtec Inc. ESQT-136-03-F-D-310	Square	0.148 in	3.76 mm	3 µin	0.076 µm	Phosphor Bronze	Gold	0.31 in	7.87 mm	0.079 in	2 mm	UL94 V-0	Through Hole	0.079 in	2 mm	Forked	4.5 A	-55 °C	125 °C	Elevated Socket	Board to Board Cable	Solder	Tin	Black	2	Push-Pull	Liquid Crystal Polymer (LCP)	All	72
Samtec Inc. ESQT-136-02-G-D-368	Square			20 µin	0.51 µm	Phosphor Bronze	Gold	0.368 in	9.35 mm	0.079 in	2 mm	UL94 V-0	Through Hole	0.079 in	2 mm	Forked	4.5 A	-55 °C	125 °C	Elevated Socket	Board to Board Cable	Solder	Gold	Black	2	Push-Pull	Liquid Crystal Polymer (LCP)	All	72	12.24 mm	0.482 in	3 µin	0.076 µm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	7	$ 31.39

Description

General part information

ESQT-136 Series

72 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

Technical documentation and resources

No documents available