
IRFZ44NLPBF
ObsoleteIR MOSFET™ N-CHANNEL ; I2PAK TO-262 PACKAGE; 17.5 MOHM;
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IRFZ44NLPBF
ObsoleteIR MOSFET™ N-CHANNEL ; I2PAK TO-262 PACKAGE; 17.5 MOHM;
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Technical Specifications
Parameters and characteristics for this part
| Specification | IRFZ44NLPBF |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 49 A |
| Drain to Source Voltage (Vdss) | 55 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Qg) (Max) @ Vgs [Max] | 63 nC |
| Input Capacitance (Ciss) (Max) @ Vds | 1470 pF |
| Mounting Type | Through Hole |
| Operating Temperature [Max] | 175 ░C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | TO-262AA, TO-262-3 Long Leads, I2PAK |
| Power Dissipation (Max) | 94 W, 3.8 W |
| Rds On (Max) @ Id, Vgs [Max] | 17.5 mOhm |
| Supplier Device Package | TO-262 |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) @ Id | 4 V |
IRFZ44 Series
| Part | Gate Charge (Qg) (Max) @ Vgs [Max] | Technology | Vgs(th) (Max) @ Id | Package / Case | Operating Temperature [Min] | Operating Temperature [Max] | Drive Voltage (Max Rds On, Min Rds On) | Input Capacitance (Ciss) (Max) @ Vds | Supplier Device Package | Mounting Type | Current - Continuous Drain (Id) @ 25°C | Rds On (Max) @ Id, Vgs | Drain to Source Voltage (Vdss) | Vgs (Max) | FET Type | Power Dissipation (Max) [Max] | Rds On (Max) @ Id, Vgs [Max] | Power Dissipation (Max) | Gate Charge (Qg) (Max) @ Vgs |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies | 65 nC | MOSFET (Metal Oxide) | 4 V | TO-220-3 | -55 °C | 175 ░C | 10 V | 1690 pF | TO-220AB | Through Hole | 57 A | 12 mOhm | 60 V | 20 V | N-Channel | 92 W | |||
Infineon Technologies | 60 nC | MOSFET (Metal Oxide) | 4 V | TO-220-3 | -55 °C | 175 ░C | 10 V | 1360 pF | TO-220AB | Through Hole | 48 A | 23 mOhm | 60 V | 20 V | N-Channel | 110 W | |||
Infineon Technologies | 63 nC | MOSFET (Metal Oxide) | 4 V | D2PAK (2 Leads + Tab) TO-263-3 TO-263AB | -55 °C | 175 ░C | 10 V | 1470 pF | D2PAK | Surface Mount | 49 A | 55 V | 20 V | N-Channel | 17.5 mOhm | 3.8 W 94 W | |||
Infineon Technologies | MOSFET (Metal Oxide) | 4 V | I2PAK TO-262-3 Long Leads TO-262AA | -55 °C | 175 ░C | 10 V | 1420 pF | TO-262 | Through Hole | 51 A | 13.9 mOhm | 55 V | 20 V | N-Channel | 80 W | 43 nC | |||
Infineon Technologies | 60 nC | MOSFET (Metal Oxide) | 4 V | D2PAK (2 Leads + Tab) TO-263-3 TO-263AB | -55 °C | 175 ░C | 10 V | 1360 pF | D2PAK | Surface Mount | 48 A | 23 mOhm | 60 V | 20 V | N-Channel | 110 W | |||
Infineon Technologies | MOSFET (Metal Oxide) | 4 V | TO-220-3 | -55 °C | 175 ░C | 10 V | 1812 pF | TO-220AB | Through Hole | 55 A | 16.5 mOhm | 60 V | 20 V | N-Channel | 115 W | ||||
Infineon Technologies | MOSFET (Metal Oxide) | 4 V | I2PAK TO-262-3 Long Leads TO-262AA | -55 °C | 175 ░C | 10 V | 1420 pF | TO-262 | Through Hole | 51 A | 13.9 mOhm | 55 V | 20 V | N-Channel | 80 W | 43 nC | |||
Infineon Technologies | 65 nC | MOSFET (Metal Oxide) | 4 V | D2PAK (2 Leads + Tab) TO-263-3 TO-263AB | -55 °C | 175 ░C | 10 V | 1690 pF | D2PAK | Surface Mount | 57 A | 12 mOhm | 60 V | 20 V | N-Channel | 92 W | |||
Infineon Technologies | MOSFET (Metal Oxide) | 4 V | TO-220-3 | -55 °C | 175 ░C | 10 V | 1812 pF | TO-220AB | Through Hole | 55 A | 16.5 mOhm | 60 V | 20 V | N-Channel | 115 W | ||||
Infineon Technologies | 63 nC | MOSFET (Metal Oxide) | 4 V | I2PAK TO-262-3 Long Leads TO-262AA | -55 °C | 175 ░C | 10 V | 1470 pF | TO-262 | Through Hole | 49 A | 55 V | 20 V | N-Channel | 17.5 mOhm | 3.8 W 94 W |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
IRFZ44 Series
The IR MOSFET family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS, lighting, load switches as well as battery powered applications.The devices are available in a variety of surface mount and through-hole packages with industry standard footprints for ease of design.
Documents
Technical documentation and resources