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12-1518-11H

12-1518-11H

Active
Aries Electronics

CONN IC DIP SOCKET 12POS GOLD

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12-1518-11H

12-1518-11H

Active
Aries Electronics

CONN IC DIP SOCKET 12POS GOLD

Find alt

Description

General part information

12-1518-11H

CONN IC DIP SOCKET 12POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification12-1518-11H
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 µin
Contact Finish Thickness - Post10 µin
Contact Material - MatingBeryllium Copper
Contact Material - PostBrass
FeaturesOpen Frame
Grid Columns6 count
Grid Rows2
Housing MaterialNylon 4/6, Glass Filled, PA46, Polyamide
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)12 count
Pitch - Mating0.1 in
Pitch - Post0.1 in
Row Spacing0.2 in
TerminationSolder
Type0.2" (5.08mm) Row Spacing, DIP

Pricing

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CAD

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Documents

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