DIP624-011BLF
ObsoleteAmphenol ICC (FCI)
CONN IC DIP SOCKET 24POS GOLD
DIP624-011BLF
ObsoleteAmphenol ICC (FCI)
CONN IC DIP SOCKET 24POS GOLD
Description
General part information
DIP624-011BLF
CONN IC DIP SOCKET 24POS GOLD
Technical Specifications
Parameters and characteristics for this part
| Specification | DIP624-011BLF |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Open Frame |
| Grid Columns | 12 |
| Grid Rows | 2 |
| Housing Material | PCT, Polycyclohexylenedimethylene Terephthalate, Glass Filled, Polyester |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 24 |
| Pitch - Mating | 0.1 in |
| Pitch - Post | 0.1 in |
| Row Spacing | 0.6 in |
| Termination | Solder |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
Pricing
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CAD
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