67SLG040035030PI00
ActiveLaird Technologies EMI
RFI FILM OVER FOAM PU SOLDER
67SLG040035030PI00
ActiveLaird Technologies EMI
RFI FILM OVER FOAM PU SOLDER
Description
General part information
67SLG040035030PI00
RFI FILM OVER FOAM PU SOLDER
Technical Specifications
Parameters and characteristics for this part
| Specification | 67SLG040035030PI00 |
|---|---|
| Attachment Method | Solder |
| Height | 0.138 in |
| Length | 0.118 in |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Operating Temperature (Max) | 70 °C |
| Operating Temperature (Min) | -40 °C |
| Shape | Rectangle |
| Type | Film Over Foam |
| Width | 0.157 in |
Pricing
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CAD
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Documents
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