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Description

General part information

MCXN236VKLT

IC

Technical Specifications

Parameters and characteristics for this part

SpecificationMCXN236VKLT
ConnectivityCANbus, SPI, UART, I2C, USART, USB, Flexcomm
Core ProcessorARM® Cortex®-M33F
Core Size (Bit Width)32 Bit
Mounting TypeSurface Mount
Number of I/O74
Operating Temperature (Max)125 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package / Case100-LQFP Exposed Pad
Package Length14 mm
Package Name100-HLQFP
Package Width14 mm
PeripheralsPOR, PWM, DMA, I2S, Reset, WDT, RNG, Brown-out Detect
Program Memory Depth1 M
Program Memory Size1 MB
Program Memory TypeFLASH
Program Memory Width8 bit
RAM Size Depth352 K
RAM Size Width8 bit
Speed150 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.71 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

    MCXN236VKLT | NXP USA Inc. | Zenode.ai