MCP2022 Series

Part	Package Length	Package Name	Package Width	Type	Duplex	Protocol	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Receiver Hysteresis	Number of Drivers	Number of Receivers	Operating Temperature (Max)	Operating Temperature (Min)	Mounting Type
Microchip Technology MCP2022-500E/P	0.3 in	14-DIP 14-PDIP	7.62 mm	Transceiver	Half	LINbus	18 V	6 V	175 mV	1	1	125 °C	-40 °C	Through Hole
Microchip Technology MCP2022PT-330E/ST	0.173 in	14-TSSOP	4.4 mm	Transceiver	Half	LINbus	18 V	6 V	175 mV	1	1	125 °C	-40 °C	Surface Mount
Microchip Technology MCP2022PT-500E/ST	0.173 in	14-TSSOP	4.4 mm	Transceiver	Half	LINbus	18 V	6 V	175 mV	1	1	125 °C	-40 °C	Surface Mount
Microchip Technology MCP2022AT-500E/ST	0.173 in	14-TSSOP	4.4 mm	Transceiver	Half	LINbus	18 V	6 V	175 mV	1	1	125 °C	-40 °C	Surface Mount
Microchip Technology MCP2022T-330E/SL	0.154 in	14-SOIC	3.9 mm	Transceiver	Half	LINbus	18 V	6 V	175 mV	1	1	125 °C	-40 °C	Surface Mount
Microchip Technology MCP2022-330E/ST	0.173 in	14-TSSOP	4.4 mm	Transceiver	Half	LINbus	18 V	6 V	175 mV	1	1	125 °C	-40 °C	Surface Mount
Microchip Technology MCP2022T-330E/ST	0.173 in	14-TSSOP	4.4 mm	Transceiver	Half	LINbus	18 V	6 V	175 mV	1	1	125 °C	-40 °C	Surface Mount
Microchip Technology MCP2022P-500E/ST	0.173 in	14-TSSOP	4.4 mm	Transceiver	Half	LINbus	18 V	6 V	175 mV	1	1	125 °C	-40 °C	Surface Mount
Microchip Technology MCP2022-500E/SL	0.154 in	14-SOIC	3.9 mm	Transceiver	Half	LINbus	18 V	6 V	175 mV	1	1	125 °C	-40 °C	Surface Mount
Microchip Technology MCP2022P-500E/SL	0.154 in	14-SOIC	3.9 mm	Transceiver	Half	LINbus	18 V	6 V	175 mV	1	1	125 °C	-40 °C	Surface Mount

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