SMDSWLF.031 2OZ
ActiveChip Quik Inc.
SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
SMDSWLF.031 2OZ
ActiveChip Quik Inc.
SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Description
General part information
SMDSWLF.031 2OZ
SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Technical Specifications
Parameters and characteristics for this part
| Specification | SMDSWLF.031 2OZ |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Diameter | 0.031 in |
| Flux Type | Water Soluble, No-Clean |
| Form | Spool |
| Form Weight | 2 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Process | Lead Free |
| Sn Composition | 96.5 % |
| Type | Wire Solder |
| Wire Gauge | 20 AWG, 22 SWG |
Pricing
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