Specification	232-72MMX55M

Adhesive	Rubber
Backing	Paper
Carrier	Paper
Color	Tan
Length (ft)	180 ft
Length (yd)	60 yd
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	70 °F
Tape Type	Masking
Thickness	0.0063 in
Width	2.83 in

232 Series

Part	Length (ft)	Length (yd)	Color	Tape Type	Backing, Carrier	Width	Adhesive	Usage	Thickness	Temperature Range (Duration)	Temperature Range (Temperature)	Storage/Refrigeration Temperature	Shelf Life Start	Shelf Life	Contact Finish - Mating	Mounting Type	Pitch - Mating	Contact Material - Mating	Housing Material	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Pitch - Post	Features	Contact Finish Thickness - Mating	Type	Contact Finish Thickness - Post	Contact Material - Post	Contact Finish - Post	Operating Temperature (Max)	Operating Temperature (Min)	Termination	Termination Post Length	Contact Resistance	Current Rating	Material Flammability Rating	Row Spacing
3M Electronic Specialty 232-48MM-55M	180 ft	60 yd	Tan	Masking	Crepe Paper Treated	1.89 in	Rubber	Medium Temp Paint Bake	0.0063 in	30 minutes	250 °F	70 °F	Date of Manufacture	12 Months
3M Electronic Specialty 232-1270-01-0602															Gold	Through Hole	0.1 in	Beryllium Copper	Glass Filled Polysulfone PSU	16	32	2	0.1 in	Closed Frame	30 µin	PGA ZIF (ZIP)	30 µin	Beryllium Copper	Gold	125 °C	-55 °C	Solder	0.154 in	25 mOhm	1 A	UL94 V-0
3M Electronic Specialty 232-5205-01															Gold	Through Hole		Beryllium Copper	PES Polyethersulfone	8	32	4		Closed Frame		QFN		Beryllium Copper	Gold			Solder	0.114 in	25 mOhm
3M Electronic Specialty 232-36MMX55M	180 ft	60 yd	Tan	Masking	Crepe Paper Treated	1.42 in	Rubber	Medium Temp Paint Bake	0.0063 in	30 minutes	250 °F	70 °F	Date of Manufacture	12 Months
3M Electronic Specialty 232-1270-02-0602															Gold	Through Hole	0.1 in	Beryllium Copper	Glass Filled Polysulfone PSU	16	32	2	0.1 in	Closed Frame	30 µin	PGA ZIF (ZIP)	30 µin	Beryllium Copper	Gold	125 °C	-55 °C	Solder	0.154 in	25 mOhm	1 A	UL94 V-0
3M Electronic Specialty 232-1287-00-0602J															Gold	Connector	0.1 in	Beryllium Copper	Glass Filled Polysulfone PSU	16	32	2	0.1 in	Closed Frame	30 µin	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	30 µin	Beryllium Copper	Gold	125 °C	-55 °C	Press-Fit	0.11 in	15 mOhm	1 A	UL94 V-0	0.6 in
3M Electronic Specialty 232-1271-00-1102JH																																		25 mOhm
3M Electronic Specialty 232-96MMX55M	180 ft	60 yd	Tan	Masking	Crepe Paper Treated	3.78 in	Rubber	Medium Temp Paint Bake	0.0063 in	30 minutes	250 °F	70 °F	Date of Manufacture	12 Months
3M Electronic Specialty 232-2601-00-0602															Gold	Through Hole	0.1 in	Beryllium Copper	Glass Filled Polysulfone PSU	32	32	1	0.1 in			SIP ZIF (ZIP)	30 µin	Beryllium Copper	Gold	125 °C	-55 °C	Solder	0.13 in		1 A	UL94 V-0
3M Electronic Specialty 232-1285-00-0602J															Gold	Connector	0.1 in	Beryllium Copper	Glass Filled Polysulfone PSU	16	32	2	0.1 in	Closed Frame	30 µin	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	30 µin	Beryllium Copper	Gold	125 °C	-55 °C	Press-Fit	0.11 in		1 A	UL94 V-0	0.6 in

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Date Code Decipher

232-72MMX55M | Datasheet