630-25AB
ActiveWakefield Thermal Solutions
HEAT SINK, SQUARE, FOR BALL GRID ARRAYS, OMNIDIRECTIONAL, PIN FIN, BGA, 35 MM, 6.4 MM, 35 MM
630-25AB
ActiveWakefield Thermal Solutions
HEAT SINK, SQUARE, FOR BALL GRID ARRAYS, OMNIDIRECTIONAL, PIN FIN, BGA, 35 MM, 6.4 MM, 35 MM
Description
General part information
630-25AB
HEAT SINK, SQUARE, FOR BALL GRID ARRAYS, OMNIDIRECTIONAL, PIN FIN, BGA, 35 MM, 6.4 MM, 35 MM
Technical Specifications
Parameters and characteristics for this part
| Specification | 630-25AB |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Fin Height | 0.25 in |
| Length | 1.378 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | BGA |
| Shape | Square, Pin Fins |
| Thermal Resistance | 7 °C/W |
| Type | Top Mount |
| Width | 1.378 in |
Pricing
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