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STM32WLE4JBI6

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SUB-GHZ WIRELESS MICROCONTROLLERS. ARM CORTEX-M4 @48 MHZ WITH 128 KBYTES OF FLASH MEMORY, 48 KBYTES OF SRAM. (G)FSK, (G)MSK, BPSK MODULATIONS. AES 256-BIT. MULTIPROTOCOL SYSTEM-ON-CHIP.

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STM32WLE4JBI6

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STMicroelectronics

SUB-GHZ WIRELESS MICROCONTROLLERS. ARM CORTEX-M4 @48 MHZ WITH 128 KBYTES OF FLASH MEMORY, 48 KBYTES OF SRAM. (G)FSK, (G)MSK, BPSK MODULATIONS. AES 256-BIT. MULTIPROTOCOL SYSTEM-ON-CHIP.

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Description Specifications Series Pricing CAD Documents

Description

General part information

STM32 Series

The STM32WB55xx and STM32WB35xx multiprotocol wireless and ultra-low-power devices embed a powerful and ultra-low-power radio compliant with the Bluetooth®Low Energy SIG specification 5.4 and with IEEE 802.15.4-2011. They contain a dedicated Arm®Cortex®-M0+ for performing all the real-time low layer operation.

The devices are designed to be extremely low-power and are based on the high-performance Arm®Cortex®-M4 32-bit RISC core operating at a frequency of up to 64 MHz. This core features a Floating point unit (FPU) single precision that supports all Arm®single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.

Enhanced inter-processor communication is provided by the IPCC with six bidirectional channels. The HSEM provides hardware semaphores used to share common resources between the two processors.

Technical Specifications

Parameters and characteristics for this part

Specification	STM32WLE4JBI6

Current - Receiving (Max)	10.22 mA
Current - Receiving (Min)	4.47 mA
Current - Transmitting (Max)	120 mA
Current - Transmitting (Min)	21 mA
Data Rate (Max)	300 kbps
Frequency (Max)	960 MHz
Frequency (Min)	150 MHz
GPIO Count	43
Grade	Automotive
Memory Size (Flash)	128 kB
Memory Type	Flash
Modulation	FSK, BPSK, GFSK, MSK, GMSK
Mounting Type	Surface Mount
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Package / Case	73-UFBGA
Package Length	5 mm
Package Name	73-UFBGA
Package Width	5 mm
Power - Output	22 dBm
Protocol	LoRaWAN 1.0, Wireless M-Bus, Sigfox
Qualification	AEC-Q100
RF Family/Standard	General ISM < 1GHz
Sensitivity	-148 dBm
Serial Interfaces	IrDA, GPIO, I2S, JTAG, SPI, USART, I2C, ADC, UART, PWM
Type	TxRx + MCU
Voltage - Supply (Maximum)	3.6 V
Voltage - Supply (Minimum)	1.8 V

STM32 Series

Sub-GHz Wireless Microcontrollers. Dual-core Arm Cortex-M4/M0+ @48 MHz with 256 Kbytes of Flash memory, 64 Kbytes of SRAM. LoRa, (G)FSK, (G)MSK, BPSK modulations. AES 256-bit. Multiprotocol System-on-Chip.

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Part	Core Processor	Package / Case	Core Size (Bit Width)	Oscillator Type	Connectivity	Package Length	Package Name	Package Width	Speed	RAM Size Depth	RAM Size Width	A/D Resolution (bits)	A/D Channels	Mounting Type	Number of I/O	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Program Memory Type	Program Memory Depth	Program Memory Width	Program Memory Size	Peripherals	Operating Temperature (Max)	Operating Temperature (Min)	Converter Architecture
STMicroelectronics STM32L412K8T6	ARM® Cortex®-M4	32-LQFP	32 Bit	Internal	I2C Infrared IrDA LINbus Quad SPI SPI UART USART USB	7 mm	32-LQFP	7 mm	80 MHz	40 K	8 bit	12 bit	10 count	Surface Mount	26	1.71 V	3.6 V	FLASH	64 K	8 bit	64 KB	Brown-out Detect DMA PWM Reset WDT	85 °C	-40 °C
STMicroelectronics STM32L412K8U6TR	ARM® Cortex®-M4	32-UFQFN Exposed Pad	32 Bit	External Internal	I2C Infrared IrDA LINbus Quad SPI SPI UART USART USB	5 mm	32-UFQFPN	5 mm	80 MHz	40 K	8 bit	12 bit	10 count	Surface Mount	26	1.71 V	3.6 V	FLASH	64 K	8 bit	64 KB	Brown-out Detect DMA PWM Reset WDT	85 °C	-40 °C	SAR
STMicroelectronics STM32L412K8U6	ARM® Cortex®-M4	32-UFQFN Exposed Pad	32 Bit	Internal	I2C Infrared IrDA LINbus Quad SPI SPI UART USART USB	5 mm	32-UFQFPN	5 mm	80 MHz	40 K	8 bit	12 bit	10 count	Surface Mount	26	1.71 V	3.6 V	FLASH	64 K	8 bit	64 KB	Brown-out Detect DMA PWM Reset WDT	85 °C	-40 °C

Pricing

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CAD

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Documents

Technical documentation and resources

Datasheet