ESQT-110-02-G-D-688

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Samtec Inc.

CONN ELEVATED SOCKET SKT 20 POS 2MM SOLDER ST TOP ENTRY THRU-HOLE LAYER

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ESQT-110-02-G-D-688

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Samtec Inc.

CONN ELEVATED SOCKET SKT 20 POS 2MM SOLDER ST TOP ENTRY THRU-HOLE LAYER

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Technical Specifications

Parameters and characteristics for this part

Specification	ESQT-110-02-G-D-688

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.51 µm
Contact Finish Thickness - Mating	20 µin
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Post	0.162 in
Contact Length - Post	4.11 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Amps)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.688 in
Insulation Height	17.48 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	20
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Style	Board to Board, Cable
Termination	Solder

ESQT-110 Series

Headers & Wire Housings FleXYZ Flexible-Height Socket Strip, 2.00mm Pitch

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Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Insulation Height	Insulation Height	Contact Finish - Mating	Number of Positions	Pitch - Mating [x]	Pitch - Mating [x]	Contact Length - Post	Contact Length - Post	Number of Positions Loaded	Material Flammability Rating	Contact Type	Insulation Color	Connector Type	Fastening Type	Termination	Current Rating (Amps)	Contact Material	Contact Finish - Post	Number of Rows	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Material	Contact Shape	Style	Row Spacing - Mating	Row Spacing - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Length - Post [x]	Contact Length - Post [x]	Number of Positions	Insulation Height [z]	Insulation Height [z]
Samtec Inc. ESQT-110-02-G-D-688	3 µin	0.076 µm	Through Hole	0.688 in	17.48 mm	Gold	20	0.079 in	2 mm	0.162 in	4.11 mm	All	UL94 V-0	Forked	Black	Elevated Socket	Push-Pull	Solder	4.5 A	Phosphor Bronze	Gold	2	0.51 µm	20 µin	Liquid Crystal Polymer (LCP)	Square	Board to Board Cable	0.079 in	2 mm	-55 °C	125 °C
Samtec Inc. ESQT-110-03-L-D-360			Through Hole	0.36 in	9.14 mm	Gold	20	0.079 in	2 mm	0.098 in	2.5 mm	All	UL94 V-0	Forked	Black	Elevated Socket	Push-Pull	Solder	4.5 A	Phosphor Bronze	Tin	2	0.25 çm	10 çin	Liquid Crystal Polymer (LCP)	Square	Board to Board Cable	0.079 in	2 mm	-55 °C	125 °C
Samtec Inc. ESQT-110-03-M-D-330			Through Hole	0.33 in	8.38 mm	Gold	20	0.079 in	2 mm	0.128 "	3.25 mm	All	UL94 V-0	Forked	Black	Elevated Socket	Push-Pull	Solder	4.5 A	Phosphor Bronze	Tin	2	0.51 µm	20 µin	Liquid Crystal Polymer (LCP)	Square	Board to Board Cable	0.079 in	2 mm	-55 °C	125 °C
Samtec Inc. ESQT-110-02-G-D-375	3 µin	0.076 µm	Through Hole	0.375 in	9.53 mm	Gold	20	0.079 in	2 mm			All	UL94 V-0	Forked	Black	Elevated Socket	Push-Pull	Solder	4.5 A	Phosphor Bronze	Gold	2	0.51 µm	20 µin	Liquid Crystal Polymer (LCP)	Square	Board to Board Cable	0.079 in	2 mm	-55 °C	125 °C	12.07 mm	0.475 in
Samtec Inc. ESQT-108-03-G-S-335	3 µin	0.076 µm	Through Hole	0.335 "	8.51 mm	Gold	8	0.079 in	2 mm			All	UL94 V-0	Forked	Black	Elevated Socket	Push-Pull	Solder	4.5 A	Phosphor Bronze	Gold	1	0.51 µm	20 µin	Liquid Crystal Polymer (LCP)	Square	Board to Board Cable			-55 °C	125 °C	3.12 mm	0.123 in
Samtec Inc. ESQT-108-03-L-D-325			Through Hole	0.325 in	8.25 mm	Gold		0.079 in	2 mm	0.133 in	3.38 mm	All	UL94 V-0	Forked	Black	Elevated Socket	Push-Pull	Solder	4.5 A	Phosphor Bronze	Tin	2	0.25 çm	10 çin	Liquid Crystal Polymer (LCP)	Square	Board to Board Cable	0.079 in	2 mm	-55 °C	125 °C			16
Samtec Inc. ESQT-102-02-L-S-755			Through Hole	0.755 in	19.18 mm	Gold	2	0.079 in	2 mm			All	UL94 V-0	Forked	Black	Elevated Socket	Push-Pull	Solder	4.5 A	Phosphor Bronze	Tin	1	0.25 çm	10 çin	Liquid Crystal Polymer (LCP)	Square	Board to Board Cable			-55 °C	125 °C	2.41 mm	0.095 in
Samtec Inc. ESQT-110-02-G-Q-728	3 µin	0.076 µm	Through Hole			Gold	40	0.079 in	2 mm	0.122 "	3.1 mm	All	UL94 V-0	Forked	Black	Elevated Socket	Push-Pull	Solder	4.5 A	Phosphor Bronze	Gold		0.51 µm	20 µin	Liquid Crystal Polymer (LCP)	Square	Board to Board Cable	0.079 in	2 mm	-55 °C	125 °C				18.5 mm	0.728 in
Samtec Inc. ESQT-108-02-M-D-690			Through Hole	0.69 "	17.52 mm	Gold		0.079 in	2 mm	0.16 in	4.06 mm	All	UL94 V-0	Forked	Black	Elevated Socket	Push-Pull	Solder	4.5 A	Phosphor Bronze	Tin	2	0.51 µm	20 µin	Liquid Crystal Polymer (LCP)	Square	Board to Board Cable	0.079 in	2 mm	-55 °C	125 °C			16
Samtec Inc. ESQT-110-02-G-D-748	3 µin	0.076 µm	Through Hole	0.748 in	19 mm	Gold	20	0.079 in	2 mm	0.102 in	2.6 mm	All	UL94 V-0	Forked	Black	Elevated Socket	Push-Pull	Solder	4.5 A	Phosphor Bronze	Gold	2	0.51 µm	20 µin	Liquid Crystal Polymer (LCP)	Square	Board to Board Cable	0.079 in	2 mm	-55 °C	125 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 12.41

Description

General part information

ESQT-110 Series

Headers & Wire Housings FleXYZ Flexible-Height Socket Strip, 2.00mm Pitch

Documents

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