4108R-2-223LF
ActiveBourns Inc.
RNET - THK FILM MOLD DIP
4108R-2-223LF
ActiveBourns Inc.
RNET - THK FILM MOLD DIP
Description
General part information
4108R-2-223LF
RNET - THK FILM MOLD DIP
Technical Specifications
Parameters and characteristics for this part
| Specification | 4108R-2-223LF |
|---|---|
| Circuit Type | Bussed |
| Height - Seated (Max) | 0.185 in |
| Mounting Type | Through Hole |
| Number of Pins | 8 |
| Number of Resistors | 7 |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -55 °C |
| Package Length | 0.3 in |
| Package Name | 8-DIP |
| Package Width | 7.62 mm |
| Power Per Element | 125 mW |
| Resistance | 22 kOhm |
| Resistor Ratio Drift | 50 ppm/°C |
| Size / Dimension Length | 0.465 in |
| Size / Dimension Width | 0.3 in |
| Temperature Coefficient | 100 ppm/°C |
| Tolerance | 2 % |
Pricing
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CAD
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Documents
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