The XENSIV™ TLE4999I3 provides all means that are necessary to fulfill the state-of-the-art functional safety requirements on system level. It is developed in full compliance with ISO 26262. The device provides high redundancy on one chip by means of two sensor elements included within one monolithic silicon design. The two diverse Hall sensor elements („main" and „sub") have internally separated signal paths within the chip. A plausibility check secures the high diagnostic coverage required for premium functional safety compliant systems up to ASIL-D. The TLE4999I3 supply architecture splits up into a digital supply and two analog supply circuits. This basic supply set-up separates the fast switching digital part from the noise-sensitive analog circuits. Two analog supply domains are the basis to ensure a good separation of the internal voltage regulation for the main and sub Hall sensor elements. Following the signal part, one finds that each sensor element has its own analog - digital converter, digital signal processor (DSP) and memory area to ensure the maximum independency. The two DSPs use their individual temperature-, stress- and Hall signal information of the related sensor cell as well as the compensation parameters stored in the EEPROM to calculate two independent output values. The implemented PSI5 communication interface supports a bitrate upto to 189 Kboud. Combining both sensor values within one output signal using the PSI5 v 2.1 protocol enables for a frame time of 500 us for both sensor data. The synchronous digital PSI5-compatible interface includes a common 7-bit checksum. Several crosschecks of the TLE4999I3 on system level can be implemented by external safety mechanisms. This way it is possible to realize functional safety compliant systems up to ASIL D.