TS391SNL250
ActiveChip Quik Inc.
THERMALLY STABLE SOLDER PASTE NO
TS391SNL250
ActiveChip Quik Inc.
THERMALLY STABLE SOLDER PASTE NO
Description
General part information
TS391SNL250
THERMALLY STABLE SOLDER PASTE NO
Technical Specifications
Parameters and characteristics for this part
| Specification | TS391SNL250 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Jar |
| Form Weight | 8.8 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Mesh Type | 4 |
| Process | Lead Free |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 77 °F |
| Storage/Refrigeration Temperature (Minimum) | 68 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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