Part	Overall Contact Length	Contact Length - Mating	Number of Positions	Insulation Height	Operating Temperature (Max)	Operating Temperature (Min)	Style	Termination	Contact Finish Thickness - Mating	Contact Finish - Mating	Number of Positions Loaded	Contact Length - Post	Contact Material	Material Flammability Rating	Insulation Color	Shrouding	Mounting Type	Contact Shape	Insulation Material	Pitch - Mating	Fastening Type	Current Rating (Per Contact)	Contact Finish - Post	Contact Type	Number of Rows	Connector Type	Row Spacing - Mating	Contact Finish Thickness - Post
Samtec Inc. MTLW-102-07-L-S-240	0.43 in	0.24 in	2	0.06 in	125 °C	-55 °C	Board Board or Cable	Solder	10 µin	Gold	All	0.13 in	Phosphor Bronze	UL94 V-0	Black	Unshrouded	Through Hole	Square	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	5.2 A	Tin	Male Pin	1	Header
Samtec Inc. MTLW-102-06-G-D-180	0.3 in	0.18 in	4	0.06 in	125 °C	-55 °C	Board Board or Cable	Solder	10 µin	Gold	All	0.06 in	Phosphor Bronze	UL94 V-0	Black	Unshrouded	Through Hole	Square	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	5.2 A	Gold	Male Pin	2	Header	0.1 in	3 µin
Samtec Inc. MTLW-102-05-G-S-200	0.335 in	0.2 in	2	0.06 in	125 °C	-55 °C	Board Board or Cable	Solder	10 µin	Gold	All	0.075 in	Phosphor Bronze	UL94 V-0	Black	Unshrouded	Through Hole	Square	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	5.2 A	Gold	Male Pin	1	Header		3 µin
Samtec Inc. MTLW-102-08-T-S-413	0.53 in	0.413 in	2	0.06 in	105 °C	-55 °C	Board Board or Cable	Solder		Tin	All	0.057 in	Phosphor Bronze	UL94 V-0	Black	Unshrouded	Through Hole	Square	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	5.2 A	Tin	Male Pin	1	Header
Samtec Inc. MTLW-102-06-G-S-125	0.3 in	0.125 in	2	0.06 in	125 °C	-55 °C	Board Board or Cable	Solder	10 µin	Gold	All	0.115 in	Phosphor Bronze	UL94 V-0	Black	Unshrouded	Through Hole	Square	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	5.2 A	Gold	Male Pin	1	Header		3 µin
Samtec Inc. MTLW-102-06-G-D-135	0.3 in	0.135 in	4	0.06 in	125 °C	-55 °C	Board Board or Cable	Solder	10 µin	Gold	All	0.105 in	Phosphor Bronze	UL94 V-0	Black	Unshrouded	Through Hole	Square	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	5.2 A	Gold	Male Pin	2	Header	0.1 in	3 µin
Samtec Inc. MTLW-102-10-L-D-750	0.83 in	0.75 in	4	0.06 in	125 °C	-55 °C	Board Board or Cable	Solder	10 µin	Gold	All	0.02 in	Phosphor Bronze	UL94 V-0	Black	Unshrouded	Through Hole	Square	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	5.2 A	Tin	Male Pin	2	Header	0.1 in
Samtec Inc. MTLW-102-06-T-D-125	0.3 in	0.125 in	4	0.06 in	105 °C	-55 °C	Board Board or Cable	Solder		Tin	All	0.115 in	Phosphor Bronze	UL94 V-0	Black	Unshrouded	Through Hole	Square	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	5.2 A	Tin	Male Pin	2	Header	0.1 in
Samtec Inc. MTLW-102-08-G-S-140	0.53 in	0.14 in	2	0.06 in	125 °C	-55 °C	Board Board or Cable	Solder	10 µin	Gold	All	0.33 in	Phosphor Bronze	UL94 V-0	Black	Unshrouded	Through Hole	Square	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	5.2 A	Gold	Male Pin	1	Header		3 µin
Samtec Inc. MTLW-102-05-G-S-177	0.335 in	0.177 in	2	0.06 in	125 °C	-55 °C	Board Board or Cable	Solder	10 µin	Gold	All	0.098 in	Phosphor Bronze	UL94 V-0	Black	Unshrouded	Through Hole	Square	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	5.2 A	Gold	Male Pin	1	Header		3 µin

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MTLW-106-08-T-S-250 | Datasheet