Part	Length (ft)	Length (yd)	Color	Tape Type	Backing, Carrier	Width	Adhesive	Usage	Thickness	Temperature Range (Duration)	Temperature Range (Temperature)	Storage/Refrigeration Temperature	Shelf Life Start	Shelf Life	Contact Finish - Mating	Mounting Type	Pitch - Mating	Contact Material - Mating	Housing Material	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Pitch - Post	Features	Contact Finish Thickness - Mating	Type	Contact Finish Thickness - Post	Contact Material - Post	Contact Finish - Post	Operating Temperature (Max)	Operating Temperature (Min)	Termination	Termination Post Length	Contact Resistance	Current Rating	Material Flammability Rating	Row Spacing
3M Electronic Specialty 232-48MM-55M	180 ft	60 yd	Tan	Masking	Crepe Paper Treated	1.89 in	Rubber	Medium Temp Paint Bake	0.0063 in	30 minutes	250 °F	70 °F	Date of Manufacture	12 Months
3M Electronic Specialty 232-1270-01-0602															Gold	Through Hole	0.1 in	Beryllium Copper	Glass Filled Polysulfone PSU	16	32	2	0.1 in	Closed Frame	30 µin	PGA ZIF (ZIP)	30 µin	Beryllium Copper	Gold	125 °C	-55 °C	Solder	0.154 in	25 mOhm	1 A	UL94 V-0
3M Electronic Specialty 232-5205-01															Gold	Through Hole		Beryllium Copper	PES Polyethersulfone	8	32	4		Closed Frame		QFN		Beryllium Copper	Gold			Solder	0.114 in	25 mOhm
3M Electronic Specialty 232-36MMX55M	180 ft	60 yd	Tan	Masking	Crepe Paper Treated	1.42 in	Rubber	Medium Temp Paint Bake	0.0063 in	30 minutes	250 °F	70 °F	Date of Manufacture	12 Months
3M Electronic Specialty 232-1270-02-0602															Gold	Through Hole	0.1 in	Beryllium Copper	Glass Filled Polysulfone PSU	16	32	2	0.1 in	Closed Frame	30 µin	PGA ZIF (ZIP)	30 µin	Beryllium Copper	Gold	125 °C	-55 °C	Solder	0.154 in	25 mOhm	1 A	UL94 V-0
3M Electronic Specialty 232-1287-00-0602J															Gold	Connector	0.1 in	Beryllium Copper	Glass Filled Polysulfone PSU	16	32	2	0.1 in	Closed Frame	30 µin	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	30 µin	Beryllium Copper	Gold	125 °C	-55 °C	Press-Fit	0.11 in	15 mOhm	1 A	UL94 V-0	0.6 in
3M Electronic Specialty 232-1271-00-1102JH																																		25 mOhm
3M Electronic Specialty 232-96MMX55M	180 ft	60 yd	Tan	Masking	Crepe Paper Treated	3.78 in	Rubber	Medium Temp Paint Bake	0.0063 in	30 minutes	250 °F	70 °F	Date of Manufacture	12 Months
3M Electronic Specialty 232-2601-00-0602															Gold	Through Hole	0.1 in	Beryllium Copper	Glass Filled Polysulfone PSU	32	32	1	0.1 in			SIP ZIF (ZIP)	30 µin	Beryllium Copper	Gold	125 °C	-55 °C	Solder	0.13 in		1 A	UL94 V-0
3M Electronic Specialty 232-1285-00-0602J															Gold	Connector	0.1 in	Beryllium Copper	Glass Filled Polysulfone PSU	16	32	2	0.1 in	Closed Frame	30 µin	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	30 µin	Beryllium Copper	Gold	125 °C	-55 °C	Press-Fit	0.11 in		1 A	UL94 V-0	0.6 in

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