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44-3570-11

44-3570-11

Active
Aries Electronics

CONN IC DIP SOCKET ZIF 44POS GLD

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44-3570-11

44-3570-11

Active
Aries Electronics

CONN IC DIP SOCKET ZIF 44POS GLD

Find alt

Description

General part information

44-3570-11

CONN IC DIP SOCKET ZIF 44POS GLD

Technical Specifications

Parameters and characteristics for this part

Specification44-3570-11
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 µin
Contact Finish Thickness - Post10 µin
Contact Material - MatingBeryllium Copper
Contact Material - PostBeryllium Copper
FeaturesClosed Frame
Grid Columns22
Grid Rows2
Housing MaterialPPS, Glass Filled, Polyphenylene Sulfide
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)44
Pitch - Mating0.1 in
Pitch - Post0.1 in
Row Spacing0.3 in
TerminationSolder
TypeZIF (ZIP), DIP, 0.3" (7.62mm) Row Spacing

Pricing

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CAD

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Documents

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