W66BP2NQQAHJ
ActiveWinbond Electronics
IC DRAM 2GBIT LVSTL 11 200TFBGA
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W66BP2NQQAHJ
ActiveWinbond Electronics
IC DRAM 2GBIT LVSTL 11 200TFBGA
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | W66BP2NQQAHJ | W66BP2 Series |
|---|---|---|
| Access Time | 3.6 ns | 3.6 ns |
| Clock Frequency | 2.133 GHz | 1.6 - 2.133 GHz |
| Memory Format | DRAM | DRAM |
| Memory Organization | 64M x 32 | 64M x 32 |
| Memory Size | 2 Gbit | 2 Gbit |
| Memory Type | Volatile | Volatile |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 105 °C | 105 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Package / Case | 200-TFBGA | 200-TFBGA |
| Supplier Device Package | 200-TFBGA | 200-TFBGA |
| Supplier Device Package [x] | 10 | 10 |
| Supplier Device Package [y] | 14.5 | 14.5 |
| Technology | SDRAM - Mobile LPDDR4 | SDRAM - Mobile LPDDR4 |
| Voltage - Supply [Max] | 1.95 V, 1.17 V | 1.17 - 1.95 V |
| Voltage - Supply [Min] | 1.06 V, 1.7 V | 1.06 - 1.7 V |
| Write Cycle Time - Word, Page | 18 ns | 18 ns |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 144 | $ 4.30 | |
W66BP2 Series
IC DRAM 2GBIT LVSTL 11 200TFBGA
| Part | Mounting Type | Write Cycle Time - Word, Page | Operating Temperature [Max] | Operating Temperature [Min] | Memory Organization | Package / Case | Voltage - Supply [Min] | Voltage - Supply [Max] | Clock Frequency | Memory Format | Memory Size | Memory Type | Technology | Supplier Device Package [y] | Supplier Device Package [x] | Supplier Device Package | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W66BP2NQQAHJ | Surface Mount | 18 ns | 105 °C | -40 °C | 64M x 32 | 200-TFBGA | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 2.133 GHz | DRAM | 2 Gbit | Volatile | SDRAM - Mobile LPDDR4 | 14.5 | 10 | 200-TFBGA | 3.6 ns |
Winbond Electronics W66BP2NQUAFJ | Surface Mount | 18 ns | 105 °C | -40 °C | 64M x 32 | 200-TFBGA | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 1.6 GHz | DRAM | 2 Gbit | Volatile | SDRAM - Mobile LPDDR4 | 14.5 | 10 | 200-TFBGA | 3.6 ns |
Description
General part information
W66BP2 Series
SDRAM - Mobile LPDDR4 Memory IC 2Gbit LVSTL_11 2.133 GHz 3.6 ns 200-TFBGA (10x14.5)
Documents
Technical documentation and resources
No documents available