NC2SWLF.031 1LB
ActiveChip Quik Inc.
LF SOLDER WIRE 99.3/0.7 TIN/COPP
NC2SWLF.031 1LB
ActiveChip Quik Inc.
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Description
General part information
NC2SWLF.031 1LB
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Technical Specifications
Parameters and characteristics for this part
| Specification | NC2SWLF.031 1LB |
|---|---|
| Composition Elements | Sn, Cu |
| Composition Formula | Sn99.3Cu0.7 |
| Cu Composition | 0.7 % |
| Diameter | 0.031 in |
| Form | Spool |
| Form Weight | 1 lb |
| Melting Point | 441 °F |
| Process | Lead Free |
| Sn Composition | 99.3 % |
| Type | Wire Solder |
| Wire Gauge | 20 AWG, 21 SWG |
Pricing
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