Specification	558-10-432M31-001104

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 µin
Contact Material - Mating	Brass
Contact Material - Post	Brass
Contact Resistance	10 mOhm
Current Rating	1 A
Features	Closed Frame
Grid Columns	31
Grid Rows	31
Housing Material	FR4 Epoxy Glass
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	432
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.05 in
Pitch - Post	0.05 in
Termination	Solder
Termination Post Length	0.086 in
Type	BGA

558-10 Series

Part	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Post	Contact Material - Post	Contact Material - Mating	Contact Finish Thickness - Mating	Features	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Pitch - Mating	Housing Material	Type	Pitch - Post	Contact Finish - Post	Mounting Type	Termination	Contact Finish - Mating	Material Flammability Rating	Current Rating	Termination Post Length	Contact Resistance
Preci-Dip 558-10-255M16-001101	125 °C	-55 °C	10 µin	Brass	Beryllium Copper	10 µin	Closed Frame	16	255	16	0.05 in	FR4 Epoxy Glass	PGA	0.05 in	Gold	Through Hole	Solder	Gold	UL94 V-0	1 A	0.111 in	10 mOhm
Preci-Dip 558-10-576M30-001104	125 °C	-55 °C	10 µin	Brass	Brass	10 µin	Closed Frame	30	576	30	0.05 in	FR4 Epoxy Glass	BGA	0.05 in	Gold	Surface Mount	Solder	Gold	UL94 V-0	1 A	0.086 in	10 mOhm
Preci-Dip 558-10-420M26-001104	125 °C	-55 °C	10 µin	Brass	Brass	10 µin	Closed Frame	26	420	26	0.05 in	FR4 Epoxy Glass	BGA	0.05 in	Gold	Surface Mount	Solder	Gold	UL94 V-0	1 A	0.086 in	10 mOhm
Preci-Dip 558-10-500M30-001104	125 °C	-55 °C	10 µin	Brass	Brass	10 µin	Closed Frame	30	500	30	0.05 in	FR4 Epoxy Glass	BGA	0.05 in	Gold	Surface Mount	Solder	Gold	UL94 V-0	1 A	0.086 in	10 mOhm
Preci-Dip 558-10-480M29-001101	125 °C	-55 °C	10 µin	Brass	Beryllium Copper	10 µin	Closed Frame	29	480	29	0.05 in	FR4 Epoxy Glass	PGA	0.05 in	Gold	Through Hole	Solder	Gold	UL94 V-0	1 A	0.111 in	10 mOhm
Preci-Dip 558-10-388M26-001101	125 °C	-55 °C	10 µin	Brass	Beryllium Copper	10 µin	Closed Frame	26	388	26	0.05 in	FR4 Epoxy Glass	PGA	0.05 in	Gold	Through Hole	Solder	Gold	UL94 V-0	1 A	0.111 in	10 mOhm
Preci-Dip 558-10-432M31-001101	125 °C	-55 °C	10 µin	Brass	Beryllium Copper	10 µin	Closed Frame	31	432	31	0.05 in	FR4 Epoxy Glass	PGA	0.05 in	Gold	Through Hole	Solder	Gold	UL94 V-0	1 A	0.111 in	10 mOhm
Preci-Dip 558-10-576M30-001101	125 °C	-55 °C	10 µin	Brass	Beryllium Copper	10 µin	Closed Frame	30	576	30	0.05 in	FR4 Epoxy Glass	PGA	0.05 in	Gold	Through Hole	Solder	Gold	UL94 V-0	1 A	0.111 in	10 mOhm
Preci-Dip 558-10-256M20-001104	125 °C	-55 °C	10 µin	Brass	Brass	10 µin	Closed Frame	20	256	20	0.05 in	FR4 Epoxy Glass	BGA	0.05 in	Gold	Surface Mount	Solder	Gold	UL94 V-0	1 A	0.086 in	10 mOhm
Preci-Dip 558-10-456M26-001101	125 °C	-55 °C	10 µin	Brass	Beryllium Copper	10 µin	Closed Frame	26	456	26	0.05 in	FR4 Epoxy Glass	PGA	0.05 in	Gold	Through Hole	Solder	Gold	UL94 V-0	1 A	0.111 in	10 mOhm

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