Specification	WB30FV60ALZ

Current - Average Rectified (Io)	30 A
Current - Reverse Leakage	10 µA
Mounting Type	Surface Mount
Operating Temperature - Junction (Max)	175 °C
Operating Temperature - Junction (Min)	-40 °C
Package / Case	Die
Package Name	Wafer
Reverse Recovery Time (trr)	65 ns
Speed - Fast Recovery (Maximum)	500 ns
Speed - Fast Recovery (Minimum)	200 mA
Technology	Standard
Voltage - DC Reverse (Vr) (Max)	600 V
Voltage - Forward (Vf) (Max)	1.55 V

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