JANKCE1N5804
ActiveMicrochip Technology
UFR,FRR DIE ROHS COMPLIANT: YES
JANKCE1N5804
ActiveMicrochip Technology
UFR,FRR DIE ROHS COMPLIANT: YES
Description
General part information
JANKCE1N5804
Diode 100 V 1A Surface Mount Die
Technical Specifications
Parameters and characteristics for this part
| Specification | JANKCE1N5804 |
|---|---|
| Capacitance | 25 pF |
| Current - Average Rectified (Io) | 1 A |
| Current - Reverse Leakage | 1 µA |
| Grade | Military |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 175 °C |
| Operating Temperature - Junction (Min) | -65 °C |
| Package / Case | Die |
| Package Name | Die |
| Qualification | MIL-PRF-19500, 477 |
| Reverse Recovery Time (trr) | 25 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 100 V |
| Voltage - Forward (Vf) (Max) | 875 mV |
Pricing
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CAD
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Documents
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