Zenode.ai Logo

Description

General part information

GS 66 P

MICA WAFERS GS 66 P

Technical Specifications

Parameters and characteristics for this part

SpecificationGS 66 P
AdhesiveNone
MaterialMica
Outline Length13.5 mm
Outline Width18 mm
ShapeRectangular
Thermal Resistivity0.15 °C/W
Thickness0.002 in
UsageTO-66-P

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Sign in to see pricing

Create a free account to access distributor pricing data.

CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

No documents available