BD25GA5WEFJ-E2
ActiveRohm Semiconductor
IC REG LIN 2.5V 500MA 8-HTSOP-J
BD25GA5WEFJ-E2
ActiveRohm Semiconductor
IC REG LIN 2.5V 500MA 8-HTSOP-J
Description
General part information
BD25GA5WEFJ-E2
IC REG LIN 2.5V 500MA 8-HTSOP-J
Technical Specifications
Parameters and characteristics for this part
| Specification | BD25GA5WEFJ-E2 |
|---|---|
| Control Features | Enable |
| Current - Output | 500 mA |
| Current - Quiescent (Iq) | 600 µA |
| Current - Supply (Max) | 900 µA |
| Mounting Type | Surface Mount |
| Number of Regulators | 1 |
| Operating Temperature (Max) | 85 °C |
| Operating Temperature (Min) | -25 °C |
| Output Configuration | Positive |
| Output Type | Fixed |
| Package Features | Exposed Pad |
| Package Length | 0.154 in |
| Package Name | 8-HTSOP-J, 8-SOIC |
| Package Width | 3.9 mm |
| Protection Features | Over Current, Soft Start, Over Temperature |
| Voltage - Input (Max) | 14 V |
| Voltage - Output (Min/Fixed) | 2.5 V |
| Voltage Dropout (Max) | 0.9 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Thermal Calculation for Linear Regulator
Anti-Whisker formation
Basics of Linear Regulators
Connecting LDOs in Parallel
Table of resistance for output voltage setting on linear regulator Ics
BDxxGC0, BDxxGA5, BDxxGA3, BDxxHC5, BDxxHC0,BDxxHA5, BDxxHA3, BDxxIC0, BDxxIA5 Series PCB Layout
Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package
Simple Test Method for Estimating the Stability of Linear Regulators
Solder Joint Rate and Thermal Resistance of Exposed Pad
Judgment Criteria of Thermal Evaluation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Power Supply Sequence Circuit with General Purpose Power Supply IC
BDxxGA5 Series Dropout Voltage
Thermal Resistance
Five Steps for Successful Thermal Design of IC
Reverse Voltage Protection
Compliance with the ELV directive
Power Source ON/OFF Characteristics for Linear Regulator
PCB Layout Thermal Design Guide
Calculating Junction Temperature from Inrush Current
How to Select Reverse Current Protection Diodes for LDO Regulators
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
HTSOP-J8 Package Information
Factory Information
Problem Situations: Power Supply Does Not Start
Six Steps for Successful Thermal Design of LDO Regulator ICs
UL94 Flame Classifications of Mold Compound
BDxxGA5 Series Spice Modeling Report
Basics of Thermal Resistance and Heat Dissipation
How to Use the Two-Resistor Model
BDxxGA5 Series Application Information
Precautions When Measuring the Rear of the Package with a Thermocouple
Usage of SPICE Macromodel (for LDO)
EMC Measures for LDOs
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Design Guide and Example of Stencil for Exposed Pad
Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
What Is Thermal Design
Impedance Characteristics of Bypass Capacitor
BD25GA5WEFJ Data Sheet