302M
ActiveWakefield Thermal Solutions
HEAT SINK, EXTRUDED, FOR POWER SEMICONDUCTORS, 3.33 °C/W, 50.8 MM, 50.8 MM, 38.1 MM
302M
ActiveWakefield Thermal Solutions
HEAT SINK, EXTRUDED, FOR POWER SEMICONDUCTORS, 3.33 °C/W, 50.8 MM, 50.8 MM, 38.1 MM
Description
General part information
302M
HEAT SINK, EXTRUDED, FOR POWER SEMICONDUCTORS, 3.33 °C/W, 50.8 MM, 50.8 MM, 38.1 MM
Technical Specifications
Parameters and characteristics for this part
| Specification | 302M |
|---|---|
| Attachment Method | Press Fit |
| Fin Height | 2 in |
| Length | 2 in |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
| Package Cooled | Stud Mounted Semiconductor Cases |
| Power Dissipation | 15 W |
| Shape | Fins, Rectangular |
| Thermal Resistance | 1.8 °C/W |
| Type | Vertical, Board Level |
| Width | 1.5 in |
Pricing
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CAD
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