XR2A-2801-N

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Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 28POS GOLD

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XR2A-2801-N

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Omron Electronics Inc-EMC Div

CONN IC DIP SOCKET 28POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	XR2A-2801-N	XR2A Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	30 Áin	10 - 30 Áin
Contact Finish Thickness - Mating	0.76 Ám	0.25 - 0.76 Ám
Contact Finish Thickness - Post	30 µin	10 - 30 µin
Contact Finish Thickness - Post	0.76 µm	0.25 - 0.76 µm
Contact Finish Thickness - Post	-	29.5 µin
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Material - Post	-	Brass
Contact Resistance	20 mOhm	20 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame	Open Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	28	8 - 28
Number of Positions or Pins (Grid)	-	2 x 16
Number of Positions or Pins (Grid)	-	32
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.2 mm	2.23 - 3.2 mm
Termination Post Length	0.126 in	0.088 - 0.126 in
Termination Post Length	-	0.138 in
Termination Post Length	-	3.5 mm
Type	DIP	DIP
Type	0.6 in	0.3 - 0.6 "
Type	15.24 mm	7.62 - 15.24 mm

XR2A Series

CONN IC DIP SOCKET 20POS GOLD

Part	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Material - Post	Type	Type	Type	Termination Post Length	Termination Post Length	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Current Rating (Amps)	Termination	Contact Resistance	Housing Material	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]	Termination Post Length [x]	Termination Post Length [x]	Contact Finish Thickness - Post
Omron Electronics Inc-EMC Div XR2A-2001-N	2.54 mm	0.1 in	20	Gold	Beryllium Copper	0.3 "	7.62 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	30 Áin	0.76 Ám	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT), Glass Filled	Open Frame	30 µin	0.76 µm	Beryllium Copper	Through Hole
Omron Electronics Inc-EMC Div XR2A-0811-N	2.54 mm	0.1 in	8	Gold	Beryllium Copper	0.3 "	7.62 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT), Glass Filled	Open Frame	10 çin	0.25 çm	Beryllium Copper	Through Hole
Omron Electronics Inc-EMC Div XR2A-3201-N	2.54 mm	0.1 in		Gold	Beryllium Copper	0.6 in	15.24 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	30 Áin	0.76 Ám	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT), Glass Filled	Open Frame	30 µin	0.76 µm	Beryllium Copper	Through Hole	2 x 16	32
Omron Electronics Inc-EMC Div XR2A-1611-N	2.54 mm	0.1 in	16	Gold	Beryllium Copper	0.3 "	7.62 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT), Glass Filled	Open Frame	10 çin	0.25 çm	Beryllium Copper	Through Hole
Omron Electronics Inc-EMC Div XR2A-0815	2.54 mm	0.1 in	8	Gold		0.3 "	7.62 mm	DIP	2.23 mm	0.088 in	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT), Glass Filled	Open Frame	10 çin	0.25 çm	Beryllium Copper	Through Hole			Brass
Omron Electronics Inc-EMC Div XR2A-3211-N	2.54 mm	0.1 in		Gold	Beryllium Copper	0.6 in	15.24 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT), Glass Filled	Open Frame	10 çin	0.25 çm	Beryllium Copper	Through Hole	2 x 16	32
Omron Electronics Inc-EMC Div XR2A-2201-N	2.54 mm	0.1 in	22	Gold		0.4 in	10.16 mm	DIP			Gold	0.1 in	2.54 mm	UL94 V-0	29.5 Áin	0.75 Ám	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT), Glass Filled	Open Frame		0.75 µm	Beryllium Copper	Through Hole			Brass	0.138 in	3.5 mm	29.5 µin
Omron Electronics Inc-EMC Div XR2A-2801-N	2.54 mm	0.1 in	28	Gold	Beryllium Copper	0.6 in	15.24 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	30 Áin	0.76 Ám	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT), Glass Filled	Open Frame	30 µin	0.76 µm	Beryllium Copper	Through Hole

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	17	$ 5.19