Specification	HMTSW-106-08-G-T-200

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	3 µin
Contact Length - Mating	0.2 in
Contact Length - Post	0.23 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating	3 A
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	0.1 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	18
Number of Positions Loaded	All
Number of Rows	3
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Overall Contact Length	0.53 in
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Shrouding	Unshrouded
Style	Board, Board or Cable
Termination	Solder

HMTSW-106 Series

...

Part	Contact Finish - Mating	Fastening Type	Current Rating	Number of Rows	Contact Finish Thickness - Mating	Insulation Height	Insulation Material	Style	Contact Length - Mating	Mounting Type	Shrouding	Termination	Contact Finish - Post	Pitch - Mating	Connector Type	Contact Shape	Number of Positions	Contact Material	Operating Temperature (Max)	Operating Temperature (Min)	Material Flammability Rating	Number of Positions Loaded	Insulation Color	Contact Type	Contact Length - Post	Overall Contact Length	Row Spacing - Mating
Samtec Inc. HMTSW-106-22-LM-S-290-NA	Gold	Push-Pull	3 A	1	10 µin	0.122 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.29 in	Right Angle Through Hole	Unshrouded	Solder	Tin	0.1 in	Header	Square	6	Phosphor Bronze	125 °C	-55 °C	UL94 V-0	All	Natural	Male Pin
Samtec Inc. HMTSW-106-23-TM-S-250	Tin	Push-Pull	3 A	1		0.1 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.25 in	Through Hole	Unshrouded	Solder	Tin	0.1 in	Header	Square	6	Phosphor Bronze	105 °C	-55 °C	UL94 V-0	All	Natural	Male Pin	0.095 in	0.445 in
Samtec Inc. HMTSW-106-08-SM-S-225-NA	Gold	Push-Pull	3 A	1	30 µin	0.122 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.225 in	Right Angle Through Hole	Unshrouded	Solder	Tin	0.1 in	Header	Square	6	Phosphor Bronze	125 °C	-55 °C	UL94 V-0	All	Natural	Male Pin
Samtec Inc. HMTSW-106-08-TM-S-180-RA	Tin	Push-Pull	3 A	1		0.122 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.18 in	Right Angle Through Hole	Unshrouded	Solder	Tin	0.1 in	Header	Square	6	Phosphor Bronze	105 °C	-55 °C	UL94 V-0	All	Natural	Male Pin
Samtec Inc. HMTSW-106-08-L-D-240	Gold	Push-Pull	3 A	2	10 µin	0.1 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.24 in	Through Hole	Unshrouded	Solder	Tin	0.1 in	Header	Square	12	Phosphor Bronze	125 °C	-55 °C	UL94 V-0	All	Natural	Male Pin	0.19 in	0.53 in	0.1 in
Samtec Inc. HMTSW-106-09-L-D-540	Gold	Push-Pull	3 A	2	10 µin	0.1 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.54 in	Through Hole	Unshrouded	Solder	Tin	0.1 in	Header	Square	12	Phosphor Bronze	125 °C	-55 °C	UL94 V-0	All	Natural	Male Pin	0.09 in	0.73 in	0.1 in
Samtec Inc. HMTSW-106-07-T-S-240	Tin	Push-Pull	3 A	1		0.1 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.24 in	Through Hole	Unshrouded	Solder	Tin	0.1 in	Header	Square	6	Phosphor Bronze	105 °C	-55 °C	UL94 V-0	All	Natural	Male Pin	0.09 in	0.43 in
Samtec Inc. HMTSW-106-08-T-S-195	Tin	Push-Pull	3 A	1		0.1 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.195 in	Through Hole	Unshrouded	Solder	Tin	0.1 in	Header	Square	6	Phosphor Bronze	105 °C	-55 °C	UL94 V-0	All	Natural	Male Pin	0.235 in	0.53 in
Samtec Inc. HMTSW-106-08-S-S-313	Gold	Push-Pull	3 A	1	30 µin	0.1 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.313 in	Through Hole	Unshrouded	Solder	Tin	0.1 in	Header	Square	6	Phosphor Bronze	125 °C	-55 °C	UL94 V-0	All	Natural	Male Pin	0.117 in	0.53 in
Samtec Inc. HMTSW-106-08-T-S-120-RA	Tin	Push-Pull	3 A	1		0.122 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.12 in	Right Angle Through Hole	Unshrouded	Solder	Tin	0.1 in	Header	Square	6	Phosphor Bronze	105 °C	-55 °C	UL94 V-0	All	Natural	Male Pin

Pricing

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HMTSW-106-08-G-T-200 | Datasheet