Specification	ESW-110-69-G-S

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	20 Ąin
Contact Finish Thickness - Post	3 µin
Contact Length - Post	0.18 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Per Contact)	5.2 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.735 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	10
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Style	Board
Termination	Solder
Voltage Rating	550 V

ESW-110 Series

...

Part	Number of Positions	Number of Positions Loaded	Connector Type	Mounting Type	Row Spacing - Mating	Current Rating (Per Contact)	Operating Temperature (Max)	Operating Temperature (Min)	Material Flammability Rating	Style	Fastening Type	Insulation Color	Voltage Rating	Number of Rows	Contact Length - Post	Insulation Height	Contact Finish - Post	Contact Finish - Mating	Termination	Contact Finish Thickness - Mating	Contact Type	Pitch - Mating	Insulation Material	Contact Shape	Contact Material	Contact Finish Thickness - Post
Samtec Inc. ESW-110-59-S-D	20	All	Elevated Socket	Through Hole	0.1 in	5.2 A	125 °C	-55 °C	UL94 V-0	Board	Push-Pull	Black	550 V	2	0.28 in	0.635 in	Tin	Gold	Solder	30 µin	Forked	0.1 in	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESW-110-33-G-S-LL	10	All	Elevated Socket	Through Hole		5.2 A	125 °C	-55 °C	UL94 V-0	Board	Push-Pull	Black	550 V	1	0.09 in	0.635 in	Gold	Gold	Kinked Pin Solder	20 Ąin	Forked	0.1 in	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze	3 µin
Samtec Inc. ESW-110-33-F-S	10	All	Elevated Socket	Through Hole		5.2 A	125 °C	-55 °C	UL94 V-0	Board	Push-Pull	Black	550 V	1	0.09 in	0.635 in	Tin	Gold	Solder	3 µin	Forked	0.1 in	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESW-110-33-S-D-LL	20	All	Elevated Socket	Through Hole	0.1 in	5.2 A	125 °C	-55 °C	UL94 V-0	Board	Push-Pull	Black	550 V	2	0.09 in	0.635 in	Tin	Gold	Kinked Pin Solder	30 µin	Forked	0.1 in	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESW-110-12-G-S	10	All	Elevated Socket	Through Hole		5.2 A	125 °C	-55 °C	UL94 V-0	Board	Push-Pull	Black	550 V	1	0.09 in	0.435 in	Gold	Gold	Solder	20 Ąin	Forked	0.1 in	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze	3 µin
Samtec Inc. ESW-110-12-S-D-LL	20	All	Elevated Socket	Through Hole	0.1 in	5.2 A	125 °C	-55 °C	UL94 V-0	Board	Push-Pull	Black	550 V	2	0.09 in	0.435 in	Tin	Gold	Kinked Pin Solder	30 µin	Forked	0.1 in	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESW-110-33-F-D	20	All	Elevated Socket	Through Hole	0.1 in	5.2 A	125 °C	-55 °C	UL94 V-0	Board	Push-Pull	Black	550 V	2	0.09 in	0.635 in	Tin	Gold	Solder	3 µin	Forked	0.1 in	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESW-110-44-T-S-LL	10	All	Elevated Socket	Through Hole		5.2 A	105 °C	-55 °C	UL94 V-0	Board	Push-Pull	Black	550 V	1	0.18 in	0.735 in	Tin	Tin	Kinked Pin Solder		Forked	0.1 in	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze
Samtec Inc. ESW-110-13-G-S	10	All	Elevated Socket	Through Hole		5.2 A	125 °C	-55 °C	UL94 V-0	Board	Push-Pull	Black	550 V	1	0.29 in	0.435 in	Gold	Gold	Solder	20 Ąin	Forked	0.1 in	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze	3 µin
Samtec Inc. ESW-110-49-G-S-LL	10	All	Elevated Socket	Through Hole		5.2 A	125 °C	-55 °C	UL94 V-0	Board	Push-Pull	Black	550 V	1	0.38 in	0.535 in	Gold	Gold	Kinked Pin Solder	20 Ąin	Forked	0.1 in	Liquid Crystal Polymer (LCP)	Square	Phosphor Bronze	3 µin

Pricing

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CAD

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Documents

Technical documentation and resources

ESW-110-69-G-S | Datasheet

ESW Drawing