4900P-25G
ActiveMG Chemicals
LEAD FREE NO CLEAN SOLDER PASTE
4900P-25G
ActiveMG Chemicals
LEAD FREE NO CLEAN SOLDER PASTE
Description
General part information
4900P-25G
LEAD FREE NO CLEAN SOLDER PASTE
Technical Specifications
Parameters and characteristics for this part
| Specification | 4900P-25G |
|---|---|
| Ag Composition | 2.8 % |
| Composition Elements | Ag, Cu, Sn |
| Composition Formula | Sn96.2Ag2.8Cu0.4 |
| Cu Composition | 0.4 % |
| Form | Syringe |
| Form Weight | 0.88 oz |
| Melting Point (Max) | 430 °F |
| Melting Point (Min) | 423 °F |
| Process | Lead Free |
| Shelf Life (Refrigerated) | 42 Months |
| Shelf Life (Room Temp) | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.2 % |
| Storage/Refrigeration Temperature (Maximum) | 50 °F |
| Storage/Refrigeration Temperature (Minimum) | 39 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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