Description
General part information
550-10-456M26-001166
BGA PIN ADAPTER 1.27MM SMD
Technical Specifications
Parameters and characteristics for this part
| Specification | 550-10-456M26-001166 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 10 µin |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Closed Frame |
| Grid Columns | 26 |
| Grid Rows | 26 |
| Housing Material | FR4 Epoxy Glass |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 456 |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -55 °C |
| Pitch - Mating | 0.05 in |
| Pitch - Post | 0.05 in |
| Termination | Solder |
| Type | BGA |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
No documents available