
67B5G4004005108R0B
ActiveLaird Technologies EMI
RFI FINGERSTOCK BECU GOLD SOLDER

67B5G4004005108R0B
ActiveLaird Technologies EMI
RFI FINGERSTOCK BECU GOLD SOLDER
Description
General part information
67B5G4004005108R0B
RFI FINGERSTOCK BECU GOLD SOLDER
Technical Specifications
Parameters and characteristics for this part
| Specification | 67B5G4004005108R0B |
|---|---|
| Attachment Method | Solder |
| Height | 0.201 in |
| Length | 0.157 in |
| Material | Beryllium Copper |
| Plating | Gold |
| Shelf Life | 12 Months |
| Storage/Refrigeration Temperature (Maximum) | 77 °F |
| Storage/Refrigeration Temperature (Minimum) | 50 °F |
| Type | Fingerstock |
| Width | 0.157 in |
Pricing
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CAD
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