Description
General part information
12878
SOLDER PASTE - 50G (LEAD FREE)
Technical Specifications
Parameters and characteristics for this part
| Specification | 12878 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Jar |
| Form Weight | 1.76 oz |
| Process | Lead Free |
| Sn Composition | 96.5 % |
| Type | Solder Paste |
Pricing
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CAD
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