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Description

General part information

2292BG

BOARD LEVEL HEAT SINK

Technical Specifications

Parameters and characteristics for this part

Specification2292BG
Attachment MethodThermal Tape, Adhesive (Not Included)
Diameter (Inner)0.3 in
Diameter (Outer)1.125 in
MaterialAluminum
Material FinishBlack Anodized
Package CooledBGA
Power Dissipation1.5 W
ShapeCylindrical
Thermal Resistance8 °C/W
TypeBoard Level

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CAD

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Documents

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