
PMEG045V050EPDAZ
NRNDNexperia USA Inc.
45 V, 5 A LOW VF MEGA SCHOTTKY BARRIER RECTIFIER

PMEG045V050EPDAZ
NRNDNexperia USA Inc.
45 V, 5 A LOW VF MEGA SCHOTTKY BARRIER RECTIFIER
Description
General part information
PMEG045 Series
Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier, encapsulated in a CFP15 (SOT1289) power and flat lead Surface-Mounted Device (SMD) plastic package.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMEG045V050EPDAZ |
|---|---|
| Capacitance | 580 pF |
| Current - Average Rectified (Io) | 5 A |
| Current - Reverse Leakage | 300 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 175 °C |
| Package / Case | TO-277, 3-PowerDFN |
| Package Name | CFP15 |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 12 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 45 V |
| Voltage - Forward (Vf) (Max) | 490 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Schottky rectifiers in CFP packages
CFP封装的肖特基整流器
CFP15; Reel pack for SMD, 13"; Q4/T2 product orientation
CFP15; Reel pack for SMD, 7"; Q4/T2 product orientation
Nexperia package poster
Evaluation of junction temperature and thermal stacks using the virtual junction
Wave soldering profile
Wave soldering guidelines for flatpack packages
PMEG045V050EPD Nexperia Product Reliability
plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body
Thermal consideration of NXP FlatPower MEGA Schottky barrier rectifiers - Selection criteria
Reflow soldering profile
Questions about package outline drawings
plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body