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Description

General part information

STM32N647B0H3Q

STM32N

Technical Specifications

Parameters and characteristics for this part

SpecificationSTM32N647B0H3Q
A/D Channels20 count
A/D Resolution (bits)12 bit
ConnectivityUART, SAI, I2C, SD, SDIO, MMC, SPI, USB, SPDIF, Ethernet, USART, LINbus, IrDA, CANbus
Converter ArchitectureSAR
Core ProcessorARM® Cortex®-M55F
Core Size (Bit Width)32 Bit
Mounting TypeSurface Mount
Number of I/O126
Operating Temperature (Max)125 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal, External
Package / Case198-VFBGA
Package Length10 mm
Package Name198-VFBGA
Package Width10 mm
PeripheralsI2S, TRNG, POR, Brown-out Detect, WDT, AES, LCD, PWM, DMA, Reset
Program Memory TypeROMless
RAM Size Depth4.2 M
RAM Size Width8 bit
Speed800 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.71 V

Pricing

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CAD

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Documents

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