ICA-628-SGG
ActiveSamtec Inc.
CONN IC DIP SOCKET 28POS GOLD
ICA-628-SGG
ActiveSamtec Inc.
CONN IC DIP SOCKET 28POS GOLD
Description
General part information
ICA-628-SGG
CONN IC DIP SOCKET 28POS GOLD
Technical Specifications
Parameters and characteristics for this part
| Specification | ICA-628-SGG |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 30 µin |
| Contact Finish Thickness - Post | 30 µin |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Open Frame |
| Grid Columns | 14 |
| Grid Rows | 2 |
| Housing Material | Polyester, Glass Filled |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 28 |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Post | 0.1 in |
| Row Spacing | 0.6 in |
| Termination | Solder |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
Pricing
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CAD
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Documents
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