Specification	ESQ-108-33-S-D-LL

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 µin
Contact Length - Post	0.09 in
Contact Type	Forked
Current Rating (Per Contact)	5.7 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.635 in
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	16
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Style	Board
Termination	Kinked Pin, Solder
Voltage Rating	550 V

ESQ Series

...

Part	Insulation Color	Style	Voltage Rating	Contact Type	Contact Length - Post	Mounting Type	Pitch - Mating	Fastening Type	Contact Finish - Mating	Termination	Number of Rows	Contact Finish - Post	Insulation Height	Current Rating (Per Contact)	Connector Type	Number of Positions Loaded	Material Flammability Rating	Operating Temperature (Min)	Operating Temperature (Max)	Number of Positions	Contact Material	Insulation Material	Contact Shape	Row Spacing - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post
Samtec Inc. ESQ-124-12-T-S	Black	Board	550 V	Forked	0.09 in	Through Hole	0.1 in	Push-Pull	Tin	Solder	1	Tin	0.435 in	5.7 A	Elevated Socket	All	UL94 V-0	-55 °C	105 °C	24 pos	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square
Samtec Inc. ESQ-110-37-G-T	Black	Board	550 V	Forked	0.09 in	Through Hole	0.1 in	Push-Pull	Gold	Solder	3	Gold	0.435 in	5.7 A	Elevated Socket	All	UL94 V-0	-55 °C	125 °C	30				0.1 in	20 Ąin
Samtec Inc. ESQ-103-33-G-D	Black	Board	550 V	Forked	0.09 in	Through Hole	0.1 in	Push-Pull	Gold	Solder	2	Gold	0.635 in	5.7 A	Elevated Socket	All	UL94 V-0	-55 °C	125 °C	6	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	0.1 in	20 Ąin	3 µin
Samtec Inc. ESQ-108-14-L-S	Black	Board	550 V	Forked	0.48 in	Through Hole	0.1 in	Push-Pull	Gold	Solder	1	Tin	0.435 in	5.7 A	Elevated Socket	All	UL94 V-0	-55 °C	125 °C	8					10 µin
Samtec Inc. ESQ-108-33-S-S	Black	Board	550 V	Forked	0.09 in	Through Hole	0.1 in	Push-Pull	Gold	Solder	1	Tin	0.635 in	5.7 A	Elevated Socket	All	UL94 V-0	-55 °C	125 °C	8					30 µin
Samtec Inc. ESQ-109-38-G-D	Black	Board	550 V	Forked	0.29 in	Through Hole	0.1 in	Push-Pull	Gold	Solder	2	Gold	0.435 in	5.7 A	Elevated Socket	All	UL94 V-0	-55 °C	125 °C	18	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	0.1 in	20 Ąin	3 µin
Samtec Inc. ESQ-107-23-T-T	Black	Board	550 V	Forked	0.19 in	Through Hole	0.1 in	Push-Pull	Tin	Solder	3	Tin	0.535 in	5.7 A	Elevated Socket	All	UL94 V-0	-55 °C	105 °C	21				0.1 in
Samtec Inc. ESQ-108-23-T-S	Black	Board	550 V	Forked	0.19 in	Through Hole	0.1 in	Push-Pull	Tin	Solder	1	Tin	0.535 in	5.7 A	Elevated Socket	All	UL94 V-0	-55 °C	105 °C	8	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square
Samtec Inc. ESQ-115-12-T-T	Black	Board	550 V	Forked	0.09 in	Through Hole	0.1 in	Push-Pull	Tin	Solder	3	Tin	0.435 in	5.7 A	Elevated Socket	All	UL94 V-0	-55 °C	105 °C	45	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	0.1 in
Samtec Inc. ESQ-130-13-G-D	Black	Board	550 V	Forked	0.29 in	Through Hole	0.1 in	Push-Pull	Gold	Solder	2	Gold	0.435 in	5.7 A	Elevated Socket	All	UL94 V-0	-55 °C	125 °C	60	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	0.1 in	20 Ąin	3 µin

Pricing

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Datasheet

ESQ-108-33-S-D-LL | Datasheet