RASWLF.031 1LB
ActiveChip Quik Inc.
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
RASWLF.031 1LB
ActiveChip Quik Inc.
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description
General part information
RASWLF.031 1LB
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Technical Specifications
Parameters and characteristics for this part
| Specification | RASWLF.031 1LB |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Diameter | 0.031 in |
| Flux Type | Rosin Activated (RA) |
| Form | Spool |
| Form Weight | 1 lb |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 422 °F |
| Process | Lead Free |
| Shelf Life | 60 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Type | Wire Solder |
| Wire Gauge | 20 SWG, 21 AWG |
Pricing
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