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W978H2KBVX1I

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Winbond Electronics

IC DRAM 256MBIT HSUL 12 134VFBGA

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W978H2KBVX1I

Active
Winbond Electronics

IC DRAM 256MBIT HSUL 12 134VFBGA

Find alt

Description

General part information

W978H2KBVX1I

IC DRAM 256MBIT HSUL 12 134VFBGA

Technical Specifications

Parameters and characteristics for this part

SpecificationW978H2KBVX1I
Access Time5.5 ns
Clock Frequency533 MHz
Memory Depth8 M
Memory FormatDRAM
Memory Interface (Type)HSUL_12
Memory Size256 Mbit
Memory TypeVolatile
Memory Width32 bit
Mounting TypeSurface Mount
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Package / Case134-VFBGA
Package Length10 mm
Package Name134-VFBGA
Package Width11.5 mm
TechnologySDRAM - Mobile LPDDR2-S4B
Voltage - Supply (Range 1 Maximum)1.3 V
Voltage - Supply (Range 1 Minimum)1.14 V
Voltage - Supply (Range 2 Maximum)1.95 V
Voltage - Supply (Range 2 Minimum)1.7 V
Write Cycle Time - Page15 ns
Write Cycle Time - Word15 ns

Pricing

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CAD

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Documents

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