
373024B00032G
ActiveBoyd Laconia, LLC
BGA HEAT SINK

373024B00032G
ActiveBoyd Laconia, LLC
BGA HEAT SINK
Description
General part information
373024B00032G
BGA HEAT SINK
Technical Specifications
Parameters and characteristics for this part
| Specification | 373024B00032G |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Fin Height | 0.35 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | ASIC...), BGA, ASIC, LGA, CPU, Assorted (BGA |
| Power Dissipation | 1.5 W |
| Thermal Resistance | 33.3 °C/W, 10 °C/W |
Pricing
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